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SPC5673FF3MVR3 PDF预览

SPC5673FF3MVR3

更新时间: 2024-10-29 14:59:23
品牌 Logo 应用领域
恩智浦 - NXP /
页数 文件大小 规格书
131页 1595K
描述
NXP 32-bit MCU, Power Arch core, 3MB Flash, 264MHz, -40/+125degC, Automotive Grade, PBGA 416

SPC5673FF3MVR3 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:TransferredReach Compliance Code:unknown
风险等级:5.68位大小:32
CPU系列:E200JESD-30 代码:S-PBGA-B416
JESD-609代码:e2湿度敏感等级:3
端子数量:416最高工作温度:125 °C
最低工作温度:-40 °C封装主体材料:PLASTIC
封装代码:BGA封装等效代码:BGA416,26X26,40
封装形状:SQUARE封装形式:GRID ARRAY
电源:1.2,3.3,5 V认证状态:Not Qualified
RAM(字节):196608ROM(单词):3145728
ROM可编程性:FLASH筛选级别:AEC-Q100
速度:264 MHz子类别:Microcontrollers
最大压摆率:1000 mA表面贴装:YES
温度等级:AUTOMOTIVE端子面层:Tin/Silver (Sn/Ag)
端子形式:BALL端子节距:1 mm
端子位置:BOTTOMBase Number Matches:1

SPC5673FF3MVR3 数据手册

 浏览型号SPC5673FF3MVR3的Datasheet PDF文件第2页浏览型号SPC5673FF3MVR3的Datasheet PDF文件第3页浏览型号SPC5673FF3MVR3的Datasheet PDF文件第4页浏览型号SPC5673FF3MVR3的Datasheet PDF文件第5页浏览型号SPC5673FF3MVR3的Datasheet PDF文件第6页浏览型号SPC5673FF3MVR3的Datasheet PDF文件第7页 
Freescale Semiconductor  
Data Sheet: Advance Information  
Document Number: MPC5674F  
Rev. 10.1, 06/2015  
MPC5674F  
TEPBGA–416  
27mm x 27mm  
TEPBGA–516  
27mm x 27mm  
MPC5674F Microcontroller  
Data Sheet  
TEPBGA–324  
23mm x 23mm  
Covers: MPC5674F and MPC5673F  
• Dual issue, 32-bit CPU core complex (e200z7)  
single action, double action, pulse width modulation  
(PWM) and modulus counter operation  
• Four enhanced queued analog-to-digital converters  
(eQADC)  
®
– Compliant with the Power Architecture embedded  
category  
– 16 KB I-Cache and 16 KB D-Cache  
– Includes an instruction set enhancement allowing  
variable length encoding (VLE), optional encoding of  
mixed 16-bit and 32-bit instructions, for code size  
footprint reduction  
– Support for 64 analog channels  
– Includes one absolute reference ADC channel  
– Includes eight decimation filters  
• Four deserial serial peripheral interface (DSPI) modules  
• Three enhanced serial communication interface (eSCI)  
modules  
• Four controller area network (FlexCAN) modules  
• Dual-channel FlexRay controller  
– Includes signal processing extension (SPE2) instruction  
support for digital signal processing (DSP) and  
single-precision floating point operations  
• 4 MB on-chip flash  
– Supports read during program and erase operations, and  
multiple blocks allowing EEPROM emulation  
• 256 KB on-chip general-purpose SRAM including 32 KB  
of standby RAM  
• Nexus development interface (NDI) per IEEE-ISTO  
5001-2003/5001-2008 standard  
• Device and board test support per Joint Test Action Group  
(JTAG) (IEEE 1149.1)  
• Two direct memory access controller (eDMA2) blocks  
– One supporting 64 channels  
• On-chip voltage regulator controller regulates supply  
voltage down to 1.2 V for core logic  
– One supporting 32 channels  
• Interrupt controller (INTC)  
• Frequency modulated phase-locked loop (FMPLL)  
• Crossbar switch architecture for concurrent access to  
peripherals, flash, or RAM from multiple bus masters  
• External bus interface (EBI) for calibration and application  
development (not available on all packages)  
• System integration unit (SIU)  
• Error correction status module (ECSM)  
• Boot assist module (BAM) supports serial bootload via  
CAN or SCI  
• Two second-generation enhanced time processor units  
(eTPU2) that share code and data RAM.  
– 32 standard channels per eTPU2  
– 24 KB code RAM  
– 6 KB parameter (data) RAM  
• Enhanced modular input output system supporting 32  
unified channels (eMIOS) with each channel capable of  
© Freescale Semiconductor, Inc., 2008-2015. All rights reserved.  

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