NXP Semiconductors
Data Sheet: Technical Data
Document Number: MPC5675K
Rev. 9, 08/2019
MPC5675K
MAPBGA–225
QFN12
MPC5675K Microcontroller
Data Sheet
15 mm x 15 mm
##_mm_x_##mm
SOT-343R
PKG-TBD
1
Introduction
##_mm_x_##mm
## mm x ## mm
TBD 257 MAPBGA
473 MAPBGA
(19 x 19 mm)
(14 x 14 mm)
1
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 Document overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.2 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Device comparison. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.4 Block diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.5 Feature list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1.6 Feature details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Package pinouts and signal descriptions . . . . . . . . . . . . . . . . 17
2.1 Package pinouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2.2 Pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
3.1 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
3.2 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . 69
3.3 Recommended operating conditions . . . . . . . . . . . . . . 70
3.4 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . 72
3.5 Electromagnetic interference (EMI) characteristics . . . 73
3.6 Electrostatic discharge (ESD) characteristics. . . . . . . . 74
3.7 Static latch-up (LU). . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
1.1
Document overview
This document provides electrical specifications, pin
assignments, and package diagrams for the MPC5675K series
of microcontroller units (MCUs).
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1.2
Description
The MPC5675K microcontroller, a SafeAssure solution, is a
32-bit embedded controller designed for advanced driver
assistance systems with RADAR, CMOS imaging, LIDAR
and ultrasonic sensors, and multiple 3-phase motor control
applications as in hybrid electric vehicles (HEV) in
automotive and high temperature industrial applications.
A member of NXP Semiconductor’s MPC5500/5600 family,
it contains the Book E compliant Power Architecture
technology core with Variable Length Encoding (VLE). This
core complies with the Power Architecture embedded
category, and is 100 percent user mode compatible with the
original Power PC™ user instruction set architecture (UISA).
It offers system performance up to four times that of its
MPC5561 predecessor, while bringing you the reliability and
familiarity of the proven Power Architecture technology.
3.8 Power
Management
Controller
(PMC)
electrical
characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
3.9 Supply current characteristics . . . . . . . . . . . . . . . . . . . 76
3.10 Temperature sensor electrical characteristics . . . . . . . 77
3.11 Main oscillator electrical characteristics . . . . . . . . . . . . 77
3.12 FMPLL electrical characteristics. . . . . . . . . . . . . . . . . . 78
3.13 16 MHz RC oscillator electrical characteristics . . . . . . 79
3.14 ADC electrical characteristics. . . . . . . . . . . . . . . . . . . . 80
3.15 Flash memory electrical characteristics . . . . . . . . . . . . 85
3.16 SRAM memory electrical characteristics . . . . . . . . . . . 87
3.17 GP pads specifications. . . . . . . . . . . . . . . . . . . . . . . . . 87
3.18 PDI pads specifications . . . . . . . . . . . . . . . . . . . . . . . . 90
3.19 DRAM pad specifications . . . . . . . . . . . . . . . . . . . . . . . 93
3.20 RESET characteristics . . . . . . . . . . . . . . . . . . . . . . . . 100
3.21 Reset sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
3.22 Peripheral timing characteristics. . . . . . . . . . . . . . . . . 107
Package characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
4.1 Package mechanical data. . . . . . . . . . . . . . . . . . . . . . 131
Orderable parts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137
Reference documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137
Document revision historys . . . . . . . . . . . . . . . . . . . . . . . . . 137
A comprehensive suite of hardware and software
development tools is available to help simplify and speed
system design. Development support is available from
leading tools vendors providing compilers, debuggers and
simulation development environments.
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NXP reserves the right to change the proudction detail specifications as may be
required to permit improvements in the design of its products.
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