NXP Semiconductors
Data Sheet: Technical Data
Document Number: MPC5643L
Rev. 10, 11/2021
MPC5643L
MAPBGA–225
QFN12
15 mm x 15 mm
##_mm_x_##mm
SOT-343R
##_mm_x_##mm
144 LQFP
PKG-TBD
MPC5643L Microcontroller
Data Sheet
## mm x ## mm
TBD
257 MAPBGA
(20 x 20 x 1.4 mm)
(14 x 14 x 0.8 mm)
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Cyclic redundancy check (CRC) unit
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High-performance e200z4d dual core
•
Decoupled Parallel mode for high-performance use of
replicated cores
Nexus Class 3+ interface
Interrupts
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GPIOs individually programmable as input, output or
special function
Three 6-channel general-purpose eTimer units
2 FlexPWM units
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32-bit Power Architecture® technology CPU
Core frequency as high as 120 MHz
Dual issue five-stage pipeline core
Variable Length Encoding (VLE)
Memory Management Unit (MMU)
4 KB instruction cache with error detection code
Signal processing engine (SPE)
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Replicated 16-priority controller
Replicated 16-channel eDMA controller
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Memory available
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1 MB flash memory with ECC
128 KB on-chip SRAM with ECC
Built-in RWW capabilities for EEPROM emulation
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Four 16-bit channels per module
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Communications interfaces
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SIL3/ASILD innovative safety concept: LockStep mode and
Fail-safe protection
2 LINFlexD channels
3 DSPI channels with automatic chip select
generation
2 FlexCAN interfaces (2.0B Active) with 32
message objects
FlexRay module (V2.1 Rev. A) with 2 channels,
64 message buffers and data rates up to 10 Mbit/s
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Sphere of replication (SoR) for key components (such as
CPU core, eDMA, crossbar switch)
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Fault collection and control unit (FCCU)
Redundancy control and checker unit (RCCU) on outputs
of the SoR connected to FCCU
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Boot-time Built-In Self-Test for Memory (MBIST) and
Logic (LBIST) triggered by hardware
Boot-time Built-In Self-Test for ADC and flash memory
triggered by software
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Two 12-bit analog-to-digital converters (ADCs)
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16 input channels
Programmable cross triggering unit (CTU) to
synchronize ADCs conversion with timer and
PWM
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Replicated safety enhanced watchdog
Replicated junction temperature sensor
Non-maskable interrupt (NMI)
16-region memory protection unit (MPU)
Clock monitoring units (CMU)
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Sine wave generator (D/A with low pass filter)
On-chip CAN/UART bootstrap loader
Single 3.0 V to 3.6 V voltage supply
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Ambient temperature range –40 °C to 125 °C
Junction temperature range –40 °C to 150 °C
Power management unit (PMU)
NXP reserves the right to change the production detail specifications as may be
required to permit improvements in the design of its products.