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SP0508BACT PDF预览

SP0508BACT

更新时间: 2024-11-19 22:36:31
品牌 Logo 应用领域
力特 - LITTELFUSE 瞬态抑制器二极管电视局域网
页数 文件大小 规格书
3页 155K
描述
Silicon Protection Circuits - TVS Avalanche Diode Array in a Unipolar Chip Scale Package

SP0508BACT 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:CSP包装说明:R-PBGA-B10
针数:10Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8541.10.00.50
风险等级:5.84Is Samacsys:N
其他特性:LOW CAPACITANCE最大钳位电压:6.8 V
配置:COMMON ANODE, 8 ELEMENTS二极管元件材料:SILICON
二极管类型:TRANS VOLTAGE SUPPRESSOR DIODEJESD-30 代码:R-PBGA-B10
JESD-609代码:e0元件数量:8
端子数量:10封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:GRID ARRAY
峰值回流温度(摄氏度):NOT SPECIFIED极性:UNIDIRECTIONAL
认证状态:Not Qualified最大重复峰值反向电压:5.5 V
子类别:Transient Suppressors表面贴装:YES
技术:AVALANCHE端子面层:TIN LEAD
端子形式:BALL端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIEDBase Number Matches:1

SP0508BACT 数据手册

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Next  
Previous  
Silicon Protection Circuits  
TVS Avalanche Diode Array in a Unipolar Chip Scale Package  
NEW  
SP0504BAC, SP0508BAC, SP0516BAC  
This family of avalanche diode arrays are designed for ESD protection  
and offered in an ultra small chip scale package.  
The multi-channel devices are used to help protect sensitive digital or  
analog input circuits on data, signal, or control lines with unipolar voltage  
levels up to 5VDC.  
The state-of-the-art structure is designed to suppress ESD and other  
transient over-voltage events to meet the International Electrotechnical  
Compatability (EMC transient immunity stantards IEC 61000-4-2 for  
Electrostatic Discharge Requirements).  
The monolithic silicon devices are comprised of specially designed  
structures for transient voltage suppression (TVS). The size and  
shape of these structures has been tailored for transient protection.  
The low capacitance and clamp voltage are ideal for high speed signal  
line protection.  
Ordering Information  
DIODE  
CHANNELS BUMPS  
CS PACKAGE  
SIZE (MM)  
PART  
NUMBER  
QUANTITY  
PER REEL  
5
4
8
6
1.804 x 1.154  
3.104 x 1.154  
3.104 x 2.454  
SP0504BACT  
SP0508BACT  
SP0516BACT  
3500  
3500  
3500  
Features  
10  
20  
An Array of 4, 8 and 16 Avalanche Diodes in a ultra small Chip Scale  
16  
Package (.65mm bump pitch)  
NOTE: Bump pitch is 0.65mm  
ESD Capability per HBM Standards  
- IEC 61000-4-2, Direct Discharge...............................25kV (Level 4)  
- IEC 61000-4-2, Air Discharge....................................30kV (Level 4)  
- MIL STD 833D (Method 3015.7) ..............................................30kV  
Signal line protection for applications up to 5VDC  
Schematic  
SP0504BAC  
SP0516BAC  
D1  
D2  
D3  
D4  
D5  
B1  
B2  
B3  
Fast response time...........................................................................< 1ns  
Low input capacitance ..........................................................39pF Typical  
Low clamp voltage ..................................................................12V Typical  
Low input leakage.....................................................................10uA Max  
Operating temperature range ............................................- 40°C to 85°C  
A1  
A2  
A3  
C1  
B1  
C2  
B2  
C3  
B3  
C4  
B4  
C5  
B5  
Applications  
Cell phone handsets  
SP0508BAC  
R1  
R2  
R3  
R4  
R5  
Personal Digital Assistants (PDA)  
Portable handheld equipment (Laptop, Palmtop computers)  
Computer port, keyboard (USB1.1)  
Set-Top Box (Audio and Video Ports)  
PCMCIA cards  
A1  
A2  
A3  
A4  
A5  
A1  
A2  
A3  
A4  
A5  
199  
www. littelfuse. com  

SP0508BACT 替代型号

型号 品牌 替代类型 描述 数据表
CM1205-08CP ONSEMI

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8-Channel ESD Protection Array in Chip Scale Package
PACDN1408CG ONSEMI

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ESD Protection Arrays in Chip Scale Package

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