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PACDN1408CG PDF预览

PACDN1408CG

更新时间： 2024-09-25 12:36:43
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
5页 112K
描述
ESD Protection Arrays in Chip Scale Package

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中文翻译

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PACDN1408CG 技术参数

是否无铅： 不含铅生命周期：Active
零件包装代码：CSP包装说明：CSP-6
针数：10Reach Compliance Code：compliant
ECCN代码：EAR99HTS代码：8541.10.00.50
Factory Lead Time：5 weeks风险等级：1.49
最大钳位电压：12 V配置：COMMON ANODE, 8 ELEMENTS
二极管元件材料：SILICON二极管类型：TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 代码：R-PBGA-B10JESD-609代码：e1
元件数量：8端子数量：10
封装主体材料：PLASTIC/EPOXY封装形状：RECTANGULAR
封装形式：GRID ARRAY峰值回流温度（摄氏度）：NOT SPECIFIED
极性：UNIDIRECTIONAL认证状态：Not Qualified
最大重复峰值反向电压：5.5 V子类别：Transient Suppressors
表面贴装：YES技术：AVALANCHE
端子面层：TIN SILVER COPPER端子形式：BALL
端子位置：BOTTOM处于峰值回流温度下的最长时间：NOT SPECIFIED

PACDN1408CG 数据手册

 浏览型号PACDN1408CG的Datasheet PDF文件第2页浏览型号PACDN1408CG的Datasheet PDF文件第3页浏览型号PACDN1408CG的Datasheet PDF文件第4页浏览型号PACDN1408CG的Datasheet PDF文件第5页 
PACDN1404  
ESD Protection Arrays in  
Chip Scale Package  
Product Description  
The PACDN1404 and PACDN1408 are 4− and 8−channel transient  
voltage suppressor arrays that provide a very high level of protection  
for sensitive electronic components that may be subjected to ESD.  
These devices are designed and characterized to safely dissipate  
ESD strikes at levels well beyond the maximum requirements set forth  
in the IEC 61000−4−2 international standard (Level 4, 8 kV contact  
discharge). All I/Os are rated at 25 kV using the IEC 61000−4−2  
contact discharge method. Using the MIL−STD−883D (Method 3015)  
specification for Human Body Model (HBM) ESD, all pins are  
protected for contact discharges to greater than 30 kV.  
The Chip Scale Package format of these devices provide extremely  
small footprints that are necessary in portable electronics such as  
cellular phones, PDAs, internet appliances and PCs. The large solder  
bumps allow for standard attachments to laminate boards without the  
use of underfill. The PACDN1404 and PACDN1408 are packaged in  
RoHS−compliant, lead−free finishing.  
http://onsemi.com  
WLCSP6  
CG SUFFIX  
CASE 567BD  
WLCSP10  
CG SUFFIX  
CASE 567BM  
ELECTRICAL SCHEMATIC  
B1  
A1  
B2  
B3  
Features  
A2  
A3  
Four or Eight Transient Voltage Suppressors in a Single Package  
In−System Electrostatic Discharge (ESD) Protection to 25 kV  
Contact Discharge per IEC 61000−4−2 International Standard  
Compact Chip Scale Package (CSP) in a 0.65 mm Pitch Format  
Saves Board Space and Eases Layout in Space Critical  
Applications Compared to Discrete Solutions and Traditional Wire  
Bonded Packages  
PACDN1404  
B1  
A1  
B2  
B3  
B4  
B5  
A5  
6− and 10−Bump WLCSPs  
These Devices are Pb−Free and are RoHS Compliant  
A2  
A3  
A4  
PACDN1408  
Applications  
MARKING DIAGRAM  
ESD Protection for Sensitive Electronic Equipment  
I/O Port, Keypad and Button Circuitry Protection for Portable  
Devices  
Wireless Handsets  
D14  
DN1408  
Handheld PCs / PDAs  
MP3 Players  
Digital Cameras and Camcorders  
Notebooks  
D14  
= PACDN1404CG  
DN1408 = PACDN1408CG  
ORDERING INFORMATION  
Desktop PCs  
†
Device  
Package  
Shipping  
PACDN1404CG  
WLCSP6 3500/Tape & Reel  
(Pb−Free)  
PACDN1408CG  
WLCSP10 3500/Tape & Reel  
(Pb−Free)  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
Semiconductor Components Industries, LLC, 2011  
1
Publication Order Number:  
October, 2011 − Rev. 4  
PACDN1404/D  
12345

中文翻译

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PACDN1408CG 替代型号

型号 品牌 替代类型 描述 数据表
CM1205-08CP ONSEMI

类似代替

 8-Channel ESD Protection Array in Chip Scale Package
SP0508BACT LITTELFUSE

功能相似

 Silicon Protection Circuits - TVS Avalanche Diode Array in a Unipolar Chip Scale Package

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 		Trans Voltage Suppressor Diode, Bidirectional, 8 Element, Silicon, 3.10 X 1.15 MM, 0.64 HE
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