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SP000641916 PDF预览

SP000641916

更新时间: 2023-01-02 23:54:31
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
19页 1266K
描述
Power Field-Effect Transistor,

SP000641916 数据手册

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600V CoolMOS" C6 Power Transistor  
IPx60R190C6  
Thermal characteristics  
3
Thermal characteristics  
Table 3  
Thermal characteristics TO-220 (IPP60R190C6),TO-247 (IPW60R190C6),TO-262 (IPI60R190C6)  
Parameter  
Symbol  
Values  
Typ.  
Unit  
Note /  
Test Condition  
Min.  
Max.  
0.83  
62  
Thermal resistance, junction - case RthJC  
-
-
-
-
°C/W  
Thermal resistance, junction -  
ambient  
RthJA  
leaded  
Soldering temperature,  
wavesoldering only allowed at  
leads  
Tsold  
-
-
260  
°C  
1.6 mm (0.063 in.)  
from case for 10 s  
Table 4  
Thermal characteristics TO-220 FullPAK (IPA60R190C6)  
Symbol Values  
Typ.  
Parameter  
Unit  
Note /  
Test Condition  
Min.  
Max.  
3.7  
Thermal resistance, junction - case RthJC  
-
-
-
-
°C/W  
Thermal resistance, junction -  
ambient  
RthJA  
80  
leaded  
Soldering temperature,  
wavesoldering only allowed at  
leads  
Tsold  
-
-
260  
°C  
1.6 mm (0.063 in.)  
from case for 10 s  
Table 5  
Thermal characteristics TO-263 (IPB60R190C6)  
Symbol Values  
Parameter  
Unit  
Note /  
Test Condition  
Min.  
Typ.  
Max.  
0.83  
62  
Thermal resistance, junction - case RthJC  
-
-
-
-
°C/W  
Thermal resistance, junction -  
ambient  
RthJA  
SMD version, device  
on PCB, minimal  
footprint  
35  
SMD version, device  
on PCB, 6cm2 cooling  
area1)  
Soldering temperature,  
Tsold  
-
-
260  
°C  
reflow MSL1  
wave- & reflow soldering allowed  
1) Device on 40mm*40mm*1.5mm one layer epoxy PCB FR4 with 6cm2 copper area (thickness 70µm) for drain connection.  
PCB is vertical without air stream cooling.  
Final Data Sheet  
5
Rev. 2.2, 2014-12-02  

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