600V CoolMOS" C6 Power Transistor
IPx60R190C6
Thermal characteristics
3
Thermal characteristics
Table 3
Thermal characteristics TO-220 (IPP60R190C6),TO-247 (IPW60R190C6),TO-262 (IPI60R190C6)
Parameter
Symbol
Values
Typ.
Unit
Note /
Test Condition
Min.
Max.
0.83
62
Thermal resistance, junction - case RthJC
-
-
-
-
°C/W
Thermal resistance, junction -
ambient
RthJA
leaded
Soldering temperature,
wavesoldering only allowed at
leads
Tsold
-
-
260
°C
1.6 mm (0.063 in.)
from case for 10 s
Table 4
Thermal characteristics TO-220 FullPAK (IPA60R190C6)
Symbol Values
Typ.
Parameter
Unit
Note /
Test Condition
Min.
Max.
3.7
Thermal resistance, junction - case RthJC
-
-
-
-
°C/W
Thermal resistance, junction -
ambient
RthJA
80
leaded
Soldering temperature,
wavesoldering only allowed at
leads
Tsold
-
-
260
°C
1.6 mm (0.063 in.)
from case for 10 s
Table 5
Thermal characteristics TO-263 (IPB60R190C6)
Symbol Values
Parameter
Unit
Note /
Test Condition
Min.
Typ.
Max.
0.83
62
Thermal resistance, junction - case RthJC
-
-
-
-
°C/W
Thermal resistance, junction -
ambient
RthJA
SMD version, device
on PCB, minimal
footprint
35
SMD version, device
on PCB, 6cm2 cooling
area1)
Soldering temperature,
Tsold
-
-
260
°C
reflow MSL1
wave- & reflow soldering allowed
1) Device on 40mm*40mm*1.5mm one layer epoxy PCB FR4 with 6cm2 copper area (thickness 70µm) for drain connection.
PCB is vertical without air stream cooling.
Final Data Sheet
5
Rev. 2.2, 2014-12-02