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SN74LVC1G18_07

更新时间： 2024-11-20 05:29:35
品牌 Logo 应用领域
德州仪器 - TI 解复用器输出元件
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13页 498K
描述
1-OF-2 NONINVERTING DEMULTIPLEXER WITH 3-STATE DESELECTED OUTPUT

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SN74LVC1G18_07 数据手册

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SN74LVC1G18  
1-OF-2 NONINVERTING DEMULTIPLEXER  
WITH 3-STATE DESELECTED OUTPUT  
www.ti.com  
SCES406I–JULY 2002–REVISED JANUARY 2007  
FEATURES  
•
Available in the Texas Instruments  
NanoFree™ Package  
•
•
•
Ioff Supports Partial-Power-Down Mode  
Operation  
•
•
•
•
•
•
Supports 5-V VCC Operation  
Latch-Up Performance Exceeds 100 mA  
Per JESD 78, Class II  
Inputs Accept Voltages to 5.5 V  
Max tpd of 3.4 ns at 3.3 V  
ESD Protection Exceeds JESD 22  
–
–
–
2000-V Human-Body Model (A114-A)  
200-V Machine Model (A115-A)  
Low Power Consumption, 10-µA Max ICC  
±24-mA Output Drive at 3.3 V  
1000-V Charged-Device Model (C101)  
Typical VOLP (Output Ground Bounce)  
<0.8 V at VCC = 3.3 V, TA = 25°C  
•
Typical VOHV (Output VOH Undershoot)  
>2 V at VCC = 3.3 V, TA = 25°C  
DBV PACKAGE  
(TOP VIEW)  
DCK PACKAGE  
(TOP VIEW)  
YZP PACKAGE  
(BOTTOM VIEW)  
3
2
1
4
5
6
A
GND  
S
Y1  
S
GND  
A
1
2
3
6
5
4
Y0  
1
2
3
6
5
4
S
GND  
A
Y0  
VCC  
VCC  
Y0  
VCC  
Y1  
Y1  
See mechanical drawings for dimensions.  
DESCRIPTION/ORDERING INFORMATION  
This noninverting demultiplexer is designed for 1.65-V to 5.5-V VCC operation.  
The SN74LVC1G18 is a 1-of-2 noninverting demultiplexer with a 3-state output. This device buffers the data on  
input A and passes it to either output Y0 or Y1, depending on whether the state of the select (S) input is low or  
high, respectively.  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER  
TOP-SIDE MARKING(2)  
_ _ _CJ_  
NanoFree™ – WCSP (DSBGA)  
0.23-mm Large Bump – YZP (Pb-free)  
Reel of 3000  
SN74LVC1G18YZPR  
–40°C to 85°C  
SOT (SOT-23) – DBV  
SOT (SC-70) – DCK  
Reel of 3000  
Reel of 3000  
SN74LVC1G18DBVR  
SN74LVC1G18DCKR  
C18_  
CJ_  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
(2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.  
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following  
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoFree is a trademark of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2002–2007, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
1234567...13

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