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SN74LVC1G19 PDF预览

SN74LVC1G19

更新时间： 2024-11-05 23:11:03
品牌 Logo 应用领域
德州仪器 - TI 解码器解复用器
页数 文件大小 规格书
11页 216K
描述
1-OF-2 DECODER/DEMULTIPLEXER

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中文翻译

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SN74LVC1G19 数据手册

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SCES464B − JUNE 2003 − REVISED SEPTEMBER 2003  
DBV OR DCK PACKAGE  
(TOP VIEW)  
D
Available in the Texas Instruments  
NanoStarand NanoFreePackages  
D
D
D
D
D
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Supports 5-V V  
Operation  
CC  
1
2
3
6
5
4
A
GND  
E
Y0  
Inputs Accept Voltages to 5.5 V  
V
CC  
Max t of 4 ns at 3.3 V  
pd  
Low Power Consumption, 10-µA Max I  
24-mA Output Drive at 3.3 V  
Y1  
CC  
YEP OR YZP PACKAGE  
(BOTTOM VIEW)  
Typical V  
(Output Ground Bounce)  
OLP  
<0.8 V at V  
= 3.3 V, T = 25°C  
CC  
A
3 4  
2 5  
1 6  
E
GND  
A
Y1  
V
Typical V  
(Output V  
Undershoot)  
OH  
OHV  
CC  
>2 V at V  
= 3.3 V, T = 25°C  
Y0  
CC  
A
I
Supports Partial-Power-Down Mode  
off  
Operation  
Latch-Up Performance Exceeds 100 mA  
Per JESD 78, Class II  
ESD Protection Exceeds JESD 22  
− 2000-V Human-Body Model (A114-A)  
− 200-V Machine Model (A115-A)  
− 1000-V Charged-Device Model (C101)  
description/ordering information  
This decoder/demultiplexer is designed for 1.65-V to 5.5-V V  
operation.  
CC  
The SN74LVC1G19 is a 1-of-2 decoder/demultiplexer. This device buffers the data on input A and passes it  
to the outputs Y0 (true) and Y1 (complement) when the enable (E) input signal is low.  
This device is fully specified for partial-power-down applications using I . The I circuitry disables the outputs,  
off  
off  
preventing damaging current backflow through the device when it is powered down.  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
†
T
A
PACKAGE  
‡
NanoStar− WCSP (DSBGA)  
0.23-mm Large Bump − YEP  
SN74LVC1G19YEPR  
Reel of 3000  
_ _ _CY_  
NanoFree− WCSP (DSBGA)  
0.23-mm Large Bump − YZP (Pb-free)  
SN74LVC1G19YZPR  
−40°C to 85°C  
Reel of 3000  
Reel of 250  
Reel of 3000  
SN74LVC1G19DBVR  
SN74LVC1G19DBVT  
SN74LVC1G19DCKR  
SOT (SOT-23) − DBV  
C19_  
CY_  
SOT (SC-70) − DCK  
Reel of 250  
SN74LVC1G19DCKT  
†
‡
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.  
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one  
following character to designate the assembly/test site. Pin  
1 identifier indicates solder-bump composition  
(1 = SnPb, • = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoStar and NanoFree are trademarks of Texas Instruments.  
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Copyright 2003, Texas Instruments Incorporated  
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1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
1234567...11

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