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SN74LVC1G139_08

更新时间： 2024-11-18 05:29:35
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德州仪器 - TI 解码器
页数 文件大小 规格书
15页 432K
描述
2-TO-4 LINE DECODER

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SN74LVC1G139_08 数据手册

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SN74LVC1G139  
2-TO-4 LINE DECODER  
www.ti.com  
SCES602B–AUGUST 2004–REVISED DECEMBER 2005  
FEATURES  
•
Available in the Texas Instruments  
NanoStar™ and NanoFree™ Packages  
•
•
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
•
•
•
•
•
•
Supports 5-V VCC Operation  
ESD Protection Exceeds JESD 22  
– 2000-V Human-Body Model (A114-A)  
– 200-V Machine Model (A115-A)  
Inputs Accept Voltages to 5.5 V  
Max tpd of 4.9 ns at 3.3 V  
Low Power Consumption, 10-µA Max ICC  
±24-mA Output Drive at 3.3 V  
– 1000-V Charged-Device Model (C101)  
abc  
Ioff Supports Partial-Power-Down Mode  
Operation  
YEP OR YZP PACKAGE  
(BOTTOM VIEW)  
DCT PACKAGE  
(TOP VIEW)  
DCU PACKAGE  
(TOP VIEW)  
4 5  
Y2  
Y1  
Y0  
GND  
Y3  
B
A
B
Y3  
V
CC  
1
2
3
4
8
7
6
5
3 6  
1
2
8
7
A
B
V
CC  
Y0  
Y1  
Y2  
2
7
A
1 8  
V
CC  
Y0  
GND  
3
4
6
5
Y3  
Y1  
Y2  
GND  
See mechanical drawings for dimensions.  
DESCRIPTION/ORDERING INFORMATION  
This 2-to-4 line decoder is designed for 1.65-V to 5.5-V VCC operation.  
The SN74LVC1G139 2-line to 4-line decoder is designed to be used in high-performance memory-decoding or  
data-routing applications requiring very short propagation delay times. In high-performance memory systems, this  
decoder can be used to minimize the effects of system decoding. When used with high-speed memories utilizing  
a fast enable circuit, the delay times of these decoders and the enable time of the memory usually are less than  
the typical access time of the memory. This means that the effective system delay introduced by the decoder is  
negligible.  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER TOP-SIDE MARKING(2)  
NanoStar™ – WCSP (DSBGA)  
0.23-mm Large Bump – YEP  
SN74LVC1G139YEPR  
_ _ _C9_  
Reel of 3000  
NanoFree™ – WCSP (DSBGA)  
0.23-mm Large Bump – YZP (Pb-free)  
SN74LVC1G139YZPR  
–40°C to 85°C  
Reel of 3000  
Reel of 250  
Reel of 3000  
Reel of 250  
SN74LVC1G139DCTR  
C39_ _ _  
SSOP – DCT  
SN74LVC1G139DCTT  
SN74LVC1G139DCUR  
C39_  
VSSOP – DCU  
SN74LVC1G139DCUT  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.  
DCU: The actual top-side marking has one additional character that designates the assembly/test site.  
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following  
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoStar, NanoFree are trademarks of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2004–2005, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
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