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SN74LVC1G139DCTR PDF预览

SN74LVC1G139DCTR

更新时间： 2024-11-17 23:11:03
品牌 Logo 应用领域
德州仪器 - TI /
页数 文件大小 规格书
10页 146K
描述
2-TO -4 LINE DECODER

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中文翻译

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SN74LVC1G139DCTR 数据手册

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SCES602 − AUGUST 2004  
DCT OR DCU PACKAGE  
(TOP VIEW)  
D
Available in the Texas Instruments  
NanoStarand NanoFreePackages  
D
D
D
D
D
D
D
D
Supports 5-V V  
Operation  
CC  
V
1
2
3
4
8
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6
5
A
B
CC  
Inputs Accept Voltages to 5.5 V  
Y0  
Y1  
Y2  
Y3  
GND  
Max t of 4.9 ns at 3.3 V  
pd  
Low Power Consumption, 10-µA Max I  
24-mA Output Drive at 3.3 V  
CC  
YEP OR YZP PACKAGE  
(BOTTOM VIEW)  
I
Supports Partial-Power-Down Mode  
off  
Operation  
4 5  
3 6  
2 7  
1 8  
GND  
Y3  
B
Y2  
Y1  
Y0  
Latch-Up Performance Exceeds 100 mA  
Per JESD 78, Class II  
ESD Protection Exceeds JESD 22  
− 2000-V Human-Body Model (A114-A)  
− 200-V Machine Model (A115-A)  
− 1000-V Charged-Device Model (C101)  
A
V
CC  
description/ordering information  
This 2-to-4 line decoder is designed for 1.65-V to 5.5-V V  
operation.  
CC  
The SN74LVC1G139 2-line to 4-line decoder is designed to be used in high-performance memory-decoding  
or data-routing applications requiring very short propagation delay times. In high-performance memory  
systems, this decoder can be used to minimize the effects of system decoding. When used with high-speed  
memories utilizing a fast enable circuit, the delay times of these decoders and the enable time of the memory  
usually are less than the typical access time of the memory. This means that the effective system delay  
introduced by the decoder is negligible.  
NanoStarand NanoFreepackage technology is a major breakthrough in IC packaging concepts, using the  
die as the package.  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
†
T
A
PACKAGE  
‡
NanoStar− WCSP (DSBGA)  
0.23-mm Large Bump − YEP  
SN74LVC1G139YEPR  
SN74LVC1G139YZPR  
Reel of 3000  
_ _ _C9_  
NanoFree− WCSP (DSBGA)  
0.23-mm Large Bump − YZP (Pb-free)  
−40°C to 85°C  
Reel of 3000  
Reel of 250  
Reel of 3000  
SN74LVC1G139DCTR  
SN74LVC1G139DCTT  
SN74LVC1G139DCUR  
SSOP − DCT  
C39_ _ _  
C39_  
VSSOP − DCU  
Reel of 250  
SN74LVC1G139DCUT  
†
‡
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.  
DCU: The actual top-side marking has one additional character that designates the assembly/test site.  
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one  
following character to designate the assembly/test site. Pin  
1 identifier indicates solder-bump composition  
(1 = SnPb, • = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoStar and NanoFree are trademarks of Texas Instruments.  
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Copyright 2004 Texas Instruments Incorporated  
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1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
1234567...10

中文翻译

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SN74LVC1G139DCTR 替代型号

型号 品牌 替代类型 描述 数据表
SN74LVC1G139DCUT TI

完全替代

 2-TO -4 LINE DECODER
SN74LVC1G139DCUR TI

完全替代

 2-TO -4 LINE DECODER
SN74LVC1G139DCTT TI

完全替代

 2-TO -4 LINE DECODER

与SN74LVC1G139DCTR相关器件

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SN74LVC1G139YEPR TI

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 		2-TO -4 LINE DECODER
SN74LVC1G139YZPR TI

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 		2-TO -4 LINE DECODER
SN74LVC1G14 TI

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 		SINGLE SCHMITT-TRIGGER INVERTER
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 		SINGLE SCHMITT-TRIGGER INVERTER
SN74LVC1G14_10 TI

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