是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | TSSOP |
包装说明: | TSSOP, TSSOP56,.3,20 | 针数: | 56 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | Factory Lead Time: | 6 weeks |
风险等级: | 1.08 | Samacsys Confidence: | 3 |
Samacsys Status: | Released | Samacsys PartID: | 755327 |
Samacsys Pin Count: | 56 | Samacsys Part Category: | Integrated Circuit |
Samacsys Package Category: | Small Outline Packages | Samacsys Footprint Name: | DGG (R-PDSO-G56) |
Samacsys Released Date: | 2018-10-21 10:56:30 | Is Samacsys: | N |
系列: | CBT/FST/QS/5C/B | JESD-30 代码: | R-PDSO-G56 |
JESD-609代码: | e4 | 长度: | 14 mm |
负载电容(CL): | 50 pF | 逻辑集成电路类型: | MULTIPLEXER AND DEMUX/DECODER |
湿度敏感等级: | 1 | 功能数量: | 12 |
输入次数: | 1 | 输出次数: | 2 |
端子数量: | 56 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 输出特性: | 3-STATE |
输出极性: | TRUE | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TSSOP | 封装等效代码: | TSSOP56,.3,20 |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
包装方法: | TR | 峰值回流温度(摄氏度): | 260 |
电源: | 5 V | 最大电源电流(ICC): | 0.003 mA |
Prop。Delay @ Nom-Sup: | 0.25 ns | 传播延迟(tpd): | 0.5 ns |
认证状态: | Not Qualified | 座面最大高度: | 1.2 mm |
子类别: | Other Logic ICs | 最大供电电压 (Vsup): | 5.5 V |
最小供电电压 (Vsup): | 4 V | 标称供电电压 (Vsup): | 5 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子面层: | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式: | GULL WING | 端子节距: | 0.5 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 6.1 mm | Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
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