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SN74CB3Q3257_08

更新时间： 2024-12-01 05:04:51
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德州仪器 - TI 解复用器开关
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18页 691K
描述
4-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER 2.5-V/3.3-V LOW-VOLTAGE HIGH-BANDWIDTH BUS SWITCH

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SN74CB3Q3257_08 数据手册

 浏览型号SN74CB3Q3257_08的Datasheet PDF文件第2页浏览型号SN74CB3Q3257_08的Datasheet PDF文件第3页浏览型号SN74CB3Q3257_08的Datasheet PDF文件第4页浏览型号SN74CB3Q3257_08的Datasheet PDF文件第5页浏览型号SN74CB3Q3257_08的Datasheet PDF文件第6页浏览型号SN74CB3Q3257_08的Datasheet PDF文件第7页 
SN74CB3Q3257  
4-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER  
2.5-V/3.3-V LOW-VOLTAGE HIGH-BANDWIDTH BUS SWITCH  
www.ti.com  
SCDS135A–SEPTEMBER 2003–REVISED MARCH 2005  
FEATURES  
•
•
Data and Control Inputs Provide Undershoot  
Clamp Diodes  
•
•
•
High-Bandwidth Data Path  
(up to 500 MHz  
(1)  
)
Low Power Consumption  
(ICC = 0.7 mA Typ)  
5-V Tolerant I/Os With Device Powered Up or  
Powered Down  
•
•
VCC Operating Range From 2.3 V to 3.6 V  
Low and Flat ON-State Resistance (ron)  
Characteristics Over Operating Range  
(ron = 4 Ω Typ)  
Data I/Os Support 0- to 5-V Signaling Levels  
(0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, 5 V)  
•
•
•
•
Control Inputs Can Be Driven by TTL or  
5-V/3.3-V CMOS Outputs  
•
Rail-to-Rail Switching on Data I/O Ports  
– 0- to 5-V Switching With 3.3-V VCC  
– 0- to 3.3-V Switching With 2.5-V VCC  
Ioff Supports Partial-Power-Down Mode  
Operation  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
•
•
Bidirectional Data Flow With Near-Zero  
Propagation Delay  
ESD Performance Tested Per JESD 22  
Low Input/Output Capacitance Minimizes  
Loading and Signal Distortion  
(Cio(OFF) = 3.5 pF Typ)  
– 2000-V Human-Body Model  
(A114-B, Class II)  
•
Fast Switching Frequency (fOE = 20 MHz Max)  
– 1000-V Charged-Device Model (C101)  
•
Supports Both Digital and Analog  
Applications: USB Interface, Differential  
Signal Interface, Bus Isolation, Low-Distortion  
Signal Gating  
(1) For additional information regarding the performance  
characteristics of the CB3Q family, refer to the TI application  
report, CBT-C, CB3T, and CB3Q Signal-Switch Families,  
literature number SCDA008.  
DBQ, DGV, OR PW PACKAGE  
(TOP VIEW)  
RGY PACKAGE  
(TOP VIEW)  
V
OE  
1
2
3
4
5
6
7
8
16  
15  
S
1B1  
1B2  
1A  
2B1  
2B2  
2A  
CC  
1
16  
14 4B1  
13 4B2  
12 4A  
15  
14  
13  
12  
11  
10  
1B1  
1B2  
1A  
2B1  
2B2  
2A  
2
3
4
5
6
7
OE  
4B1  
4B2  
4A  
3B1  
3B2  
11 3B1  
10  
9
3B2  
3A  
GND  
8
9
DESCRIPTION/ORDERING INFORMATION  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER  
SN74CB3Q3257RGYR  
SN74CB3Q3257DBQR  
SN74CB3Q3257PWR  
TOP-SIDE MARKING  
BU257  
QFN – RGY  
Tape and reel  
Tape and reel  
Tape and reel  
Tape and reel  
SSOP (QSOP) – DBQ  
TSSOP – PW  
BU257  
–40°C to 85°C  
BU257  
TVSOP – DGV  
SN74CB3Q3257DGVR  
BU257  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2003–2005, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
1234567...18

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