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SN74AUC1G07_07 PDF预览

SN74AUC1G07_07

更新时间： 2024-11-01 06:12:55
品牌 Logo 应用领域
德州仪器 - TI 驱动器输出元件
页数 文件大小 规格书
13页 473K
描述
SINGLE BUFFER/DRIVER WITH OPEN-DRAIN OUTPUT

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SN74AUC1G07_07 数据手册

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SN74AUC1G07  
SINGLE BUFFER/DRIVER  
WITH OPEN-DRAIN OUTPUT  
www.ti.com  
SCES373Q–SEPTEMBER 2001–REVISED JULY 2007  
FEATURES  
•
Available in the Texas Instruments  
NanoFree™ Package  
•
•
•
Low Power Consumption, 10-μA Max ICC  
±8-mA Output Drive at 1.8 V  
•
Optimized for 1.8-V Operation and Is 3.6-V I/O  
Tolerant to Support Mixed-Mode Signal  
Operation  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
•
ESD Protection Exceeds JESD 22  
•
Ioff Supports Partial-Power-Down Mode  
Operation  
–
–
–
2000-V Human-Body Model (A114-A)  
200-V Machine Model (A115-A)  
•
•
Sub-1-V Operable  
1000-V Charged-Device Model (C101)  
Max tpd of 2.5 ns at 1.8 V  
DBV PACKAGE  
(TOP VIEW)  
DCK PACKAGE  
(TOP VIEW)  
DRY PACKAGE  
(TOP VIEW)  
YZP PACKAGE  
(BOTTOM VIEW)  
3
2
1
4
Y
VCC  
GND  
A
NC  
A
1
2
3
5
1
2
3
6
5
4
NC  
A
VCC  
NC  
Y
1
2
3
5
4
NC  
A
VCC  
5
VCC  
DNU  
GND  
4
GND  
Y
Y
GND  
See mechanical drawings for dimensions.  
DNU – Do not use  
NC – No internal connection  
DESCRIPTION/ORDERING INFORMATION  
This single buffer/driver is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC  
operation.  
The output of the SN74AUC1G07 is open drain and can be connected to other open-drain outputs to implement  
active-low wired-OR or active-high wired-AND functions.  
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the  
package.  
ORDERING INFORMATION  
TA  
PACKAGE(1)(2)  
ORDERABLE PART NUMBER  
TOP-SIDE MARKING(3)  
NanoFree™ – WCSP (DSBGA)  
0.23-mm Large Bump – YZP  
(Pb-free)  
Reel of 3000  
SN74AUC1G07YZPR  
_ _ _UV_  
–40°C to 85°C  
SON – DRY  
Reel of 5000  
Reel of 3000  
Reel of 3000  
SN74AUC1G07DRYR  
SN74AUC1G07DBVR  
SN74AUC1G07DCKR  
PREVIEW  
U07_  
SOT (SOT-23) – DBV  
SOT (SC-70) – DCK  
UV_  
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.  
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
website at www.ti.com.  
(3) DBV/DCK/DRY: The actual top-side marking has one additional character that designates the wafer fab/assembly site.  
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following  
character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoFree is a trademark of Texas Instruments.  
UNLESS OTHERWISE NOTED this document contains  
Copyright © 2001–2007, Texas Instruments Incorporated  
PRODUCTION DATA information current as of publication date.  
Products conform to specifications per the terms of Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
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