SN74AHC1G86-EP
SINGLE 2-INPUT EXCLUSIVE-OR GATE
www.ti.com
SCLS709–FEBRUARY 2008
1
FEATURES
•
•
•
•
Max tpd of 10 ns at 5 V
•
Controlled Baseline
Low Power Consumption, 10 µA Max ICC
±8 mA Output Drive at 5 V
–
–
–
One Assembly Site
One Test Site
Schmitt Trigger Action at All Inputs Makes the
Circuit Tolerant for Slower Input Rise and Fall
Time
One Fabrication Site
•
•
Extended Temperature Performance of –55°C
to 125°C
•
Latch-Up Performance Exceeds 250 mA Per
JESD 17
Enhanced Diminishing Manufacturing Sources
(DMS) Support
•
•
ESD Protection Exceeds JESD 22
•
•
•
Enhanced Product-Change Notification
(1)
–
–
–
2000-V Human-Body Model (A114-A)
200-V Machine Model (A115-A)
Qualification Pedigree
Operating Range of 2 V to 5.5 V
1000-V Charged-Device Model (C101)
(1) Component qualification in accordance with JEDEC and
industry standards to ensure reliable operation over an
extended temperature range. This includes, but is not limited
to, Highly Accelerated Stress Test (HAST) or biased 85/85,
temperature cycle, autoclave or unbiased HAST,
electromigration, bond intermetallic life, and mold compound
life. Such qualification testing should not be viewed as
justifying use of this component beyond specified
performance and environmental limits.
DCK PACKAGE
(TOP VIEW)
DBV PACKAGE
(TOP VIEW)
DRL PACKAGE
(TOP VIEW)
A
B
VCC
1
2
3
5
1
2
3
5
A
B
VCC
1
2
3
5
4
A
B
VCC
4
GND
Y
4
GND
Y
Y
GND
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
The SN74AHC1G86 is a single 2-input exclusive-OR gate. The device performs the Boolean function Y = A
or Y = AB + AB in positive logic.
B
A common application is as a true/complement element. If one of the inputs is low, the other input is reproduced
in true form at the output. If one of the inputs is high, the signal on the other input is reproduced inverted at the
output.
ORDERING INFORMATION(1)
ORDERABLE PART
TA
PACKAGE(2)
SOT (SC-70) - DCK Reel of 3000
TOP-SIDE MARKING(3)
CGB
NUMBER
–55°C to 125°C
SN74AHC1G86MDCKREP
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(3) The actual top-side marking has one additional character that designates the assembly/test site.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2008, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.