ꢀꢁ ꢂꢃ ꢄꢅꢆ ꢇ ꢈ ꢉꢊ ꢀꢁꢇ ꢃꢄꢅ ꢆꢇ ꢈꢉ
ꢋ ꢌꢍꢉꢄ ꢎꢏꢍ ꢐꢑ ꢒ ꢓ ꢄ ꢔꢑ ꢏ ꢓꢄꢋ ꢑ ꢀ
ꢕ ꢔꢍꢖ ꢌ ꢄꢒ ꢉꢗ
SCLS399J − APRIL 1998 − REVISED APRIL 2005
D
D
D
D
D
2-V to 5.5-V V
Operation
D
D
D
Support Mixed-Mode Voltage Operation on
All Ports
CC
Max t of 10.5 ns at 5 V
pd
Latch-Up Performance Exceeds 250 mA Per
JESD 17
Typical V
<0.8 V at V
(Output Ground Bounce)
OLP
CC
= 3.3 V, T = 25°C
A
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
Typical V
>2.3 V at V
(Output V
Undershoot)
OHV
CC
OH
= 3.3 V, T = 25°C
A
I
Supports Partial-Power-Down Mode
off
− 1000-V Charged-Device Model (C101)
Operation
SN54LV273A . . . J OR W PACKAGE
SN74LV273A . . . DB, DGV, DW, NS,
OR PW PACKAGE
SN74LV273A . . . RGY PACKAGE
(TOP VIEW)
SN54LV273A . . . FK PACKAGE
(TOP VIEW)
(TOP VIEW)
1
20
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
CLR
1Q
1D
2D
2Q
3Q
3D
4D
4Q
V
CC
3
2
1
20 19
18
1Q
1D
2D
2Q
3Q
3D
4D
4Q
19 8Q
2
3
4
5
6
7
8
9
2D
2Q
3Q
3D
4D
8D
17 7D
4
5
6
7
8
8Q
8D
7D
7Q
6Q
6D
5D
5Q
CLK
18
17
16
15
14
13
12
8D
7D
7Q
6Q
6D
5D
5Q
16
15
14
7Q
6Q
6D
9 10 11 12 13
10
11
GND
description/ordering information
The ’LV273A devices are octal D-type flip-flops designed for 2-V to 5.5-V V
operation.
CC
ORDERING INFORMATION
ORDERABLE
TOP-SIDE
MARKING
†
PACKAGE
T
A
PART NUMBER
SN74LV273ARGYR
SN74LV273ADW
SN74LV273ADWR
SN74LV273ANSR
SN74LV273ADBR
SN74LV273APW
SN74LV273APWR
SN74LV273APWT
SN74LV273ADGVR
SNJ54LV273AJ
QFN − RGY
SOIC − DW
Reel of 1000
Tube of 25
LV273A
LV273A
LV273A
74LV273A
LV273A
Reel of 2000
Reel of 2000
Reel of 2000
Tube of 70
SOP − NS
SSOP − DB
−40°C to 85°C
Reel of 2000
Reel of 250
Reel of 2000
Tube of 20
TSSOP − PW
LV273A
TVSOP − DGV
CDIP − J
LV273A
SNJ54LV273AJ
SNJ54LV273AW
SNJ54LV273AFK
CFP − W
Tube of 85
SNJ54LV273AW
SNJ54LV273AFK
−55°C to 125°C
LCCC − FK
Tube of 55
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2005, Texas Instruments Incorporated
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