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SMLJ6.0A-TP-HF PDF预览

SMLJ6.0A-TP-HF

更新时间: 2024-11-19 13:13:43
品牌 Logo 应用领域
美微科 - MCC /
页数 文件大小 规格书
8页 429K
描述
Trans Voltage Suppressor Diode, 3000W, 6V V(RWM), Unidirectional, 1 Element, Silicon, DO-214AB, SMC, 2 PIN

SMLJ6.0A-TP-HF 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:R-PDSO-C2Reach Compliance Code:not_compliant
ECCN代码:EAR99HTS代码:8541.10.00.50
风险等级:5.23其他特性:UL RECOGNIZED, EXCELLENT CLAMPING CAPABILITY, PD-MIN
最大击穿电压:7.37 V最小击穿电压:6.67 V
击穿电压标称值:7.02 V最大钳位电压:10.3 V
配置:SINGLE二极管元件材料:SILICON
二极管类型:TRANS VOLTAGE SUPPRESSOR DIODEJEDEC-95代码:DO-214AB
JESD-30 代码:R-PDSO-C2JESD-609代码:e3
湿度敏感等级:1最大非重复峰值反向功率耗散:3000 W
元件数量:1端子数量:2
最高工作温度:175 °C最低工作温度:-55 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性:UNIDIRECTIONAL最大重复峰值反向电压:6 V
子类别:Transient Suppressors表面贴装:YES
技术:AVALANCHE端子面层:Tin (Sn)
端子形式:C BEND端子位置:DUAL
处于峰值回流温度下的最长时间:10Base Number Matches:1

SMLJ6.0A-TP-HF 数据手册

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SMLJ5.0  
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SMLJ170CA  
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Features  
Transient  
Voltage Suppressor  
5.0 to 170 Volts  
3000 Watt  
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For surface mount application in order to optimize board space  
Low inductance  
Low profile package  
Built-in strain relief  
Glass passivated junction  
Excellent clamping capability  
Repetition Rate( duty cycle): 0.5%  
Fast response time: typical less than 1ps from 0V to BV min  
Typical ID less than 1uA above 10V  
High temperature soldering: 250oC/10 seconds at terminals  
Plastic package has Underwrites Laboratory Flammability  
Classification 94V-O  
DO-214AB  
(SMLJ) (LEAD FRAME)  
G
H
D
Mechanical Data  
A
C
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CASE: JEDEC DO-214AB molded plastic body over  
E
passivated junction  
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Terminals: solderable per MIL-STD-750, Method 2026  
Polarity: Color band denotes positive end( cathode) except  
Bi-directional types.  
F
DIMENSIONS  
INCHES  
MIN  
.079  
.115  
.002  
.006  
.030  
..305  
.260  
.220  
MM  
MIN  
2.00  
2.92  
0.051  
0.152  
0.76  
7.75  
DIM  
A
B
C
D
E
F
G
H
MAX  
MAX  
2.62  
NOTE  
.103  
.121  
.008  
.012  
.050  
.320  
.280  
.245  
3.07  
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Standard packaging: 16mm tape per ( EIA 481).  
Weight: 0.007 ounce, 0.21 gram  
0.203  
0.305  
1.27  
8.13  
7.11  
6.22  
6.60  
5.59  
Maximum Ratings @ 25oC Unless Otherwise Specified  
Peak Pulse Current on  
10/1000us  
waveform(Note1, Fig3)  
Peak Pulse Power  
Disspation on 10/1000us  
waveform(Note1,2,Fig1)  
Peak forward surge  
current (JEDEC  
IPPM See Table 1 Amps  
SUGGESTED SOLDER  
PAD LAYOUT  
0.280"  
PPPM Minimum Watts  
3000  
IFSM)  
200.0  
Amps  
0.121”  
Method) (Note 2,3)  
Operation And Storage  
Temperature Range  
TJ,  
TSTG  
-55oC to  
+150oC  
0.060”  
NOTES:  
1.  
2.  
3.  
Non-repetitive current pulse per Fig.3 and derated above TA=25oC per Fig.2.  
Mounted on 8.0mm2 copper pads to each terminal.  
8.3ms, single half sine-wave or equivalent square wave, duty cycle=4 pulses per. Minutes maximum.  
www.mccsemi.com  

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