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SML312BCT PDF预览

SML312BCT

更新时间: 2024-11-14 09:18:51
品牌 Logo 应用领域
罗姆 - ROHM 可见光LED光电
页数 文件大小 规格书
3页 220K
描述
High Brightness Type Mini-molded chip LEDs

SML312BCT 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Not Recommended包装说明:ROHS COMPLIANT, SMD, 2 PIN
Reach Compliance Code:compliantHTS代码:8541.40.20.00
风险等级:5.21Is Samacsys:N
颜色:BLUE颜色@波长:Blue
配置:SINGLE最大正向电流:0.02 A
JESD-609代码:e4透镜类型:CLEAR
标称发光强度:90.0 mcd安装特点:SURFACE MOUNT
功能数量:1端子数量:2
最高工作温度:85 °C最低工作温度:-30 °C
光电设备类型:SINGLE COLOR LED总高度:0.8 mm
包装方法:TAPE AND REEL峰值波长:468 nm
最大反向电压:5 V形状:RECTANGULAR
尺寸:1.2 mm子类别:Visible LEDs
表面贴装:YES端子面层:Gold (Au) - with Nickel (Ni) barrier
端子节距:1 mmBase Number Matches:1

SML312BCT 数据手册

 浏览型号SML312BCT的Datasheet PDF文件第2页浏览型号SML312BCT的Datasheet PDF文件第3页 
SURFACE MOUNT LED LAMPS  
High Brightness Type Mini-molded chip LEDs  
SML31* Series  
Blue  
Green  
Package Size�  
(mm)�  
GaN on SiC  
428nm  
InGaN on SiC  
468nm  
525nm  
1608  
(
)
0603  
1.6×0.8  
t=0.8  
SML310BAT  
SML311BBT  
SML312BCT  
SML311EBT  
SML312ECT  
Note) "-" will be taken out for emitting color B/E series.  
Absolute Maximum Ratings(Ta=25℃)�  
External Dimensions(Unit:mm)�  
Peak�  
1.6 +0.2  
1.2  
Power� Forward�  
dissipation current�  
Reverse�Operating� Stotage�  
voltage temperature temperature�  
0
forward�  
Emitting�  
color  
Part No.  
current  
PD  
IF  
VR  
Topr  
Tstg  
IFP  
mWmA)�  
V)� (°C)�  
°C)�  
mA)�  
SML310BAT  
SML311BBT  
SML312BCT  
SML311EBT  
SML312ECT  
94  
70  
Blue  
20  
84  
5
-30 to +85  
-40 to +100  
100  
Green  
Cathode mark  
IFP measured under duty 1/10,1kHz.  
Electrical Optical Characteristics(Ta=25℃)�  
Light wavelength  
Brightness�  
Terminal  
Forward� Reverse�  
1.0  
IV  
voltage�  
current�  
Peak Half-wave  
Part No.  
Resin Color  
VF  
IR  
λp  
∆λ  
Tolerance:±0.1  
Typ.  
( )  
V
IF  
mA  
Max.  
VR  
( )  
V
Typ. Typ.  
IF  
mA  
Min. Typ.  
IF  
mA  
(
)
(µ )  
(
)
(
)
(
)
(
)
(
)
(
)
A
nm  
nm  
mcd mcd  
SML310BAT  
SML311BBT  
SML312BCT  
SML311EBT  
SML312ECT  
3.8  
3.5  
3.8  
428  
65  
1.4  
14  
22  
36  
90  
3.6  
22  
Directivity  
468  
26  
Transparent�  
Clear  
0°  
20  
100  
5
20  
63  
20  
X’  
Y’  
30°  
30°  
36  
36  
90  
523  
518  
200  
60°  
60°  
90°  
100  
90°  
100  
50  
0
50  
(
)
%
Relative brightness  
(
)
Typ.  
Recommemded Pad Layout  
Packaging Spacifications(Unit:mm)�  
Tape Spacifications:T863,000pcsreel〉  
Reel Spacifications  
0.8  
Feeding direction  
4
φ1.5  
2
φ1 3  
1.1  
1.0  
(Unit:mm)�  
φ6 0  
The recommended thickness of the screen mask  
for soldering is between 100 and 200μm. The  
hole size of the screen mask should be same as  
the recommended land pattern or smaller.  
φ180  

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