SMBSAC30-TP

更新时间： 2024-11-02 13:13:39

品牌	Logo	应用领域
美微科 - MCC		瞬态抑制器二极管光电二极管局域网
页数	文件大小	规格书
4页	260K
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中文翻译

获取价格

数据手册

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SMBSAC30-TP 数据手册

SMBSAC5.0

THRU

SMBSAC50

M C C

Micro Commercial Components

ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents

20736 Marilla Street Chatsworth

ꢆꢋꢅꢌꢍꢎꢍꢍ

ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ

$ꢉ%ꢒꢅ ꢅ ꢅ ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ

Features

l For surface mount applications in order to optimize board space

Low Capacitance

Transient Voltage

Suppressors

• Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates

Compliant. See ordering information)

l Excellent clamping capability

l Fast response time: typical less than 1.0ps from 0 volts to

V_BRminimum

5 to 50 Volts 500Watt

l Ideal for data line applications

l UL Recognized File# E331408

DO-214AA

(SMB) (LEAD FRAME)

Mechanical Data

Epoxy meets UL 94 V-0 flammability rating

Moisture Sensitivity Level 1

Terminals: solderable per MIL-STD-750, Method 2026

The band denotes TVS cathode

Maximum soldering temperature: 260^oC for 10 seconds

Maximum Ratings @ 25^oC Unless Otherwise Specified

Peak Pulse Current on

10/1000us waveform

I_PP

See Table 1 Note: 2

Peak Pulse Power

Dissipation

P_PP

500W

Note: 2,

Steady State Power

Dissipation

^oC

P_D

Watt

DIMENSIONS

TL= 75 With at

lead

lengths 0.375"(9.5mm)

INCHES

MIN

DIM

MAX

2.44

2.20

0.203

0.305

1.52

5.59

4.70

3.94

NOTE

-55^oC to

+175^oC

.083

.075

.002

.096

.086

.008

.012

.060

.220

.185

.155

2.13

Operation and Storage T_J, T_STG

Temperature Range

1.91

0.051

0.152

0.76

.006-

.030

.200

.160

.130

5.08

NOTES:

4.06

3.30

1. High Temperature Solder Exemptions Applied, see EU Directive Annex 7.

2. Non-repetitive current pulse, per Fig.3 and derated above

T_A=25^oC per Fig.2.

SUGGESTED SOLDER

PAD LAYOUT

3. Mounted on 5.0mm²copper pads to each terminal.

0.106"

0.082”

Transient

Voltage

Suppressor

Diode

0.050”

Schematic Diagram

www.mccsemi.com

1 of 4

Revision: A

2011/01/01

12 3 4

中文翻译

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