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SMBSAC30-TP-HF PDF预览

SMBSAC30-TP-HF

更新时间: 2024-11-02 21:07:35
品牌 Logo 应用领域
美微科 - MCC 局域网光电二极管
页数 文件大小 规格书
4页 304K
描述
Trans Voltage Suppressor Diode, 500W, 30V V(RWM), Unidirectional, 1 Element, Silicon, DO-214AA, SMB, 2 PIN

SMBSAC30-TP-HF 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:R-PDSO-C2Reach Compliance Code:not_compliant
ECCN代码:EAR99HTS代码:8541.10.00.50
风险等级:5.77其他特性:EXCELLENT CLAMPING CAPABILITY, UL RECOGNIZED
最小击穿电压:33.3 V击穿电压标称值:33.3 V
最大钳位电压:48.6 V配置:SINGLE
二极管元件材料:SILICON二极管类型:TRANS VOLTAGE SUPPRESSOR DIODE
JEDEC-95代码:DO-214AAJESD-30 代码:R-PDSO-C2
湿度敏感等级:1最大非重复峰值反向功率耗散:500 W
元件数量:1端子数量:2
最高工作温度:175 °C最低工作温度:-55 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性:UNIDIRECTIONAL最大功率耗散:3 W
最大重复峰值反向电压:30 V子类别:Transient Suppressors
表面贴装:YES技术:AVALANCHE
端子形式:C BEND端子位置:DUAL
处于峰值回流温度下的最长时间:10Base Number Matches:1

SMBSAC30-TP-HF 数据手册

 浏览型号SMBSAC30-TP-HF的Datasheet PDF文件第2页浏览型号SMBSAC30-TP-HF的Datasheet PDF文件第3页浏览型号SMBSAC30-TP-HF的Datasheet PDF文件第4页 
SMBSAC5.0  
THRU  
SMBSAC50  
M C C  
Micro Commercial Components  
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20736 Marilla Street Chatsworth  
ꢆꢋꢅꢌꢍꢎꢍꢍ  
ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ  
$ꢉ%ꢒꢅ   ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ  
TM  
Features  
Low Capacitance  
Transient Voltage  
Suppressors  
For surface mount applications in order to optimize board space  
Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates  
Compliant. See ordering information)  
Excellent clamping capability  
Fast response time: typical less than 1.0ps from 0 volts to  
V
BR minimum  
5 to 50 Volts 500Watt  
Halogen free available upon request by adding suffix "-HF"  
Ideal for data line applications  
UL Recognized File# E331408  
DO-214AA  
(SMB) (LEAD FRAME)  
Mechanical Data  
l
Epoxy meets UL 94 V-0 flammability rating  
G
Moisture Sensitivity Level 1  
l
l
l
Terminals: solderable per MIL-STD-750, Method 2026  
The band denotes TVS cathode  
H
Maximum soldering temperature: 260oC for 10 seconds  
D
Maximum Ratings @ 25oC Unless Otherwise Specified  
A
C
Peak Pulse Current on  
10/1000us waveform  
IPP  
See Table 1 Note: 2  
E
Peak Pulse Power  
Dissipation  
PPP  
500W  
3
Note: 2,  
3
B
F
Steady State Power  
Dissipation  
oC  
PD  
Watt  
DIMENSIONS  
TL= 75 With at  
lead  
lengths 0.375"(9.5mm)  
INCHES  
MIN  
MM  
MIN  
DIM  
A
MAX  
MAX  
2.44  
2.20  
0.203  
0.305  
1.52  
5.59  
4.70  
3.94  
NOTE  
-55oC to  
+175oC  
.083  
.075  
.002  
.096  
.086  
.008  
.012  
.060  
.220  
.185  
.155  
2.13  
Operation and Storage TJ, TSTG  
Temperature Range  
B
1.91  
C
0.051  
0.152  
0.76  
D
.006-  
.030  
.200  
.160  
.130  
E
F
5.08  
NOTES:  
G
H
4.06  
3.30  
1. High Temperature Solder Exemptions Applied, see EU Directive Annex 7.  
2. Non-repetitive current pulse, per Fig.3 and derated above  
TA=25oC per Fig.2.  
SUGGESTED SOLDER  
PAD LAYOUT  
3. Mounted on 5.0mm2 copper pads to each terminal.  
0.106"  
0.082”  
Transient  
Voltage  
Suppressor  
Diode  
0.050”  
Schematic Diagram  
www.mccsemi.com  
1 of 4  
Revision: B  
2013/01/01  

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