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SM8S33-2E PDF预览

SM8S33-2E

更新时间: 2024-01-02 22:25:18
品牌 Logo 应用领域
威世 - VISHAY 局域网二极管
页数 文件大小 规格书
4页 89K
描述
Trans Voltage Suppressor Diode, 5200W, 33V V(RWM), Unidirectional, 1 Element, Silicon, DO-218AB

SM8S33-2E 技术参数

是否Rohs认证: 不符合生命周期:Transferred
零件包装代码:DO-218包装说明:R-PSSO-C1
针数:1Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8541.10.00.50
风险等级:5.59其他特性:PATENTED DEVICE
最大击穿电压:44.9 V最小击穿电压:36.7 V
击穿电压标称值:40.8 V外壳连接:ANODE
最大钳位电压:59 V配置:SINGLE
二极管元件材料:SILICON二极管类型:TRANS VOLTAGE SUPPRESSOR DIODE
JEDEC-95代码:DO-218ABJESD-30 代码:R-PSSO-C1
JESD-609代码:e0最大非重复峰值反向功率耗散:5200 W
元件数量:1端子数量:1
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE极性:UNIDIRECTIONAL
最大功率耗散:8 W认证状态:Not Qualified
最大重复峰值反向电压:33 V子类别:Transient Suppressors
表面贴装:YES技术:AVALANCHE
端子面层:Tin/Lead (Sn/Pb)端子形式:C BEND
端子位置:SINGLEBase Number Matches:1

SM8S33-2E 数据手册

 浏览型号SM8S33-2E的Datasheet PDF文件第2页浏览型号SM8S33-2E的Datasheet PDF文件第3页浏览型号SM8S33-2E的Datasheet PDF文件第4页 
SM8S Series  
New Product  
Vishay Semiconductors  
formerly General Semiconductor  
Surface Mount Automotive Transient Voltage Suppressors  
Stand-off Voltage 10 to 43V  
Peak Pulse Power 6600W (10/1000µs)  
5200W (10/10,000µs)  
DO-218AB  
0.628(16.0)  
0.592(15.0)  
0.539(13.7)  
0.524(13.3)  
0.116(3.0)  
0.093(2.4)  
0.413(10.5) 0.342(8.7)  
0.374(9.5) 0.327(8.3)  
Mounting Pad Layout  
0.091(2.3)  
0.067(1.7)  
0.366(9.3)  
0.343(8.7)  
0.116(3.0)  
0.093(2.4)  
0.413(10.5)  
0.374(9.5)  
0.406(10.3)  
0.382(9.7)  
Dimensions in  
inches and (millimeters)  
LEAD 1  
0.150(3.8)  
0.366(9.3)  
0.138(3.5)  
0.098(2.5)  
0.126(3.2)  
0.343(8.7)  
0.197(5.0)  
0.185(4.7)  
0.606(15.4)  
0.583(14.8)  
0.028(0.7)  
0.020(0.5)  
0.016 (0.4) Min.  
*
Patent #’s:  
4,980,315  
5,166,769  
5,278,095  
0.098(2.5)  
0.059(1.5)  
LEAD 2/METAL HEATSINK  
Features  
Mechanical Data  
• Ideally suited for load dump protection  
• Plastic package has Underwriters Laboratory  
Flammability Classification 94V-0  
• High temperature stability due to unique oxide passiva-  
tion and patented PAR® construction  
• Integrally molded heatsink provides a very low thermal  
resistance for maximum heat dissipation  
• Low leakage current at TJ = 175°C  
Case: Molded plastic body, surface mount with heatsink  
integrally mounted in the encapsulation  
Terminals: Plated, solderable per MIL-STD-750, Method 2026  
Polarity: Heatsink is anode  
Mounting Position: Any  
Weight: 0.091 oz., 2.58 g  
Packaging codes/options:  
• High temperature soldering guaranteed:  
260°C for 10 seconds at terminals  
• Meets ISO7637-2 surge spec.  
2D/750 per 13" Reel (16mm Tape),  
anode towards sprocket hole, 4.5K/box  
2E/750 per 13" Reel (16mm Tape),  
cathode towards sprocket hole, 4.5K/box  
• Low forward voltage drop  
Maximum Ratings and Thermal Characteristics(T = 25°C unless otherwise noted)  
C
Parameter  
Symbol  
Value  
Unit  
Peak pulse power dissipation with 10/1000µs waveform  
10/10,000µs waveform  
6600  
5200  
PPPM  
W
Steady state power dissipation  
PD  
IPPM  
8.0  
See Table 1  
700  
W
A
Peak pulse current with a 10/1000µs waveform(1)  
Peak forward surge current, 8.3ms single half sine-wave  
Typical thermal resistance junction to case  
Operating junction and storage temperature range  
IFSM  
A
RθJC  
0.90  
°C/W  
°C  
TJ, TSTG  
-55 to +175  
Notes: (1) Non-repetitive current pulse derated above TA=25°C  
Document Number 88387  
04-Jun-04  
www.vishay.com  
1

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