M C C
SM5817PL
THRU
SM5819PL
ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents
20736 Marilla Street Chatsworth
ꢆꢋꢅꢌꢍꢎꢍꢍ
ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ
$ꢉ%ꢒꢅ ꢅ ꢅ ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ
TM
Micro Commercial Components
Features
Schottky Barrier
Diodes
•
•
•
·
High-Surge-Capability
Low Forward Voltage
Low-Profile-Package
Lead Free Finish/RoHS Compliant(Note 1) ("P" Suffix designates
RoHS Compliant. See ordering information)
20 to 40 Volts
Mechanical Data
·
·
Packaging: SOD-123FL
Epoxy meets UL 94 V-0 flammability rating
SOD-123FL
·
Moisture Sensitivity Level 1
•
Marking Code:
SM5817PL---K2;SM5818PL---K3 ; SM5819PL---K4
A
B
Maximum Ratings
Symbol
Rating
Rating
Unit
C
E
Maximum RMS Voltage
SM5817PL
SM5818PL
SM5819PL
14
21
28
VRMS
V
Repetitive Reverse Voltage
SM5817PL
20
VRRM
SM5818PL
SM5819PL
30
40
V
H
Rectified Current (Average) Half Wave
Rectification with Resist. Load at
TL=90OC
D
IF(AV)
IFSM
RthJA
RthJC
RthJL
PD
1.0
30
88
43
30
A
A
C/W
C/W
Surge Forward Current at ,TL=70OC,8.3ms
G
O
O
DIMENSIONS
Typical Thermal Resistance(Note2)
O
C/W
DIM
INCHES
MIN
MM
NOTE
1.14
Power Dissipation
Junction Temperature
Storage Temperature
W
MAX
.152
.112
.071
.053
.039
-----
.008
MIN
3.55
2.55
1.40
0.95
0.50
0.25
----
MAX
3.85
2.85
1.80
1.35
1.00
-----
.20
O
TJ
TSTG
-65 to +125
-65 to +125
C
A
B
C
D
E
G
H
.140
.100
.055
.037
.020
.010
-----
O
C
Electrical Characteristics @ 25OC Unless Otherwise Specified
Symbol
VF
Parameter
Forward Voltage
Min
SM5817PL ---
SM5818PL ---
Typ Max Units
0.45 ---
0.56 ---
0.60
V
(@1A dc)
---
---
SM5819PL
SUGGESTED SOLDER
PAD LAYOUT
IR
Leakage Current
0.093”
O
---
---
0.1
9.0
----
mA
mA
C
@TA=25
@TA=100 O
---
---
C
0.048”
C
j
Typical--Junction--Capacitance
@f=1.0MHz,Vr=4V
---
110
pF
Note: 1. High Temperature Solder Exemptions Applied, see EU Directive Annex 7.
2. Thermal Resistence : PC Board Mounted on 0.2*0.2"(5*5mm) copper pad area.
0.036”
www.mccsemi.com
1 of 3
Revision: A
2011/01/01