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SLF5N60S PDF预览

SLF5N60S

更新时间: 2024-10-01 18:09:31
品牌 Logo 应用领域
美浦森 - Maplesemi /
页数 文件大小 规格书
6页 542K
描述
TO-220F

SLF5N60S 数据手册

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SLP5N60S / SLF5N60S  
600V N-Channel MOSFET  
General Description  
Features  
This Power MOSFET is produced using Maple semi‘s  
advanced planar stripe DMOS technology.  
- 4.5A, 600V, RDS(on)Typ = 1.8Ω@VGS = 10 V  
- Low gate charge ( typical 13.3nC)  
- High ruggedness  
- Fast switching  
- 100% avalanche tested  
This advanced technology has been especially tailored  
to minimize on-state resistance, provide superior switching  
performance, and withstand high energy pulse in the  
avalanche and commutation mode. These devices are well  
suited for high efficiency switched mode power supplies,  
active power factor correction based on half bridge topology.  
- Improved dv/dt capability  
D
G
TO-220  
TO-220F  
G D  
S
G D S  
S
Absolute Maximum Ratings  
TC = 25°C unless otherwise noted  
SLP5N60S  
Symbol  
Parameter  
SLF5N60S  
Units  
Drain-Source Voltage  
600  
V
VDSS  
Drain Current  
- Continuous (TC = 25)  
- Continuous (TC = 100)  
- Pulsed  
4.5  
2.5  
16  
A
A
ID  
(Note 1)  
IDM  
VGSS  
EAS  
IAR  
Drain Current  
A
Gate-Source Voltage  
±30  
128  
4.5  
3.5  
5.5  
V
(Note 2)  
(Note 1)  
(Note 1)  
(Note 3)  
Single Pulsed Avalanche Energy  
Avalanche Current  
mJ  
A
EAR  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
mJ  
V/ns  
W
dv/dt  
PD  
Power Dissipation (TC = 25)  
Operating and Storage Temperature Range  
Maximum lead temperature for soldering purposes,  
104  
36  
TJ, TSTG  
-55 to +150  
300  
TL  
1/8" from case for 5 seconds  
Thermal Characteristics  
Max  
Symbol  
Parameter  
Units  
SLP5N60S  
SLF5N60S  
Thermal Resistance, Junction-to-Case  
Thermal Resistance, Case-to-Sink Typ.  
Thermal Resistance, Junction-to-Ambient  
1.2  
3.47  
/W  
/W  
/W  
RθJC  
RθJS  
RθJA  
0.5  
--  
62.5  
62.5  
Maple Semiconductor CO., LTD  
http://www.maplesemi.com  
Rev. 01 April. 2018  

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