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SKIIP632GB120-3D PDF预览

SKIIP632GB120-3D

更新时间: 2024-10-25 22:43:11
品牌 Logo 应用领域
赛米控丹佛斯 - SEMIKRON /
页数 文件大小 规格书
2页 72K
描述
2-pack - integrated intelligent Power System

SKIIP632GB120-3D 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete包装说明:,
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.84
其他特性:ALSO OPERATES AT 20 TO 30V NON STABILIZED POWER SUPPLY内置保护:TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE
接口集成电路类型:HALF BRIDGE BASED PERIPHERAL DRIVERJESD-30 代码:R-XXMA-X
JESD-609代码:e2功能数量:3
最高工作温度:85 °C最低工作温度:-40 °C
输出电流流向:SOURCE AND SINK标称输出峰值电流:0.005 A
封装主体材料:UNSPECIFIED封装形状:RECTANGULAR
封装形式:MICROELECTRONIC ASSEMBLY峰值回流温度(摄氏度):NOT SPECIFIED
认证状态:Not Qualified最大供电电压:15.6 V
最小供电电压:14.4 V标称供电电压:15 V
表面贴装:NO温度等级:INDUSTRIAL
端子面层:Tin/Silver (Sn/Ag)端子形式:UNSPECIFIED
端子位置:UNSPECIFIED处于峰值回流温度下的最长时间:NOT SPECIFIED
断开时间:1.4 µs接通时间:1.5 µs
Base Number Matches:1

SKIIP632GB120-3D 数据手册

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This technical information specifies semiconductor devices but promises no  
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delivery, performance or suitability.  
Case S 3  
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06-04-2005 ARW  
© by SEMIKRON  

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