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SKIIP642GB120-208CTVU PDF预览

SKIIP642GB120-208CTVU

更新时间: 2024-11-19 14:31:03
品牌 Logo 应用领域
赛米控丹佛斯 - SEMIKRON 驱动接口集成电路
页数 文件大小 规格书
1页 14K
描述
Half Bridge Based Peripheral Driver, 750A

SKIIP642GB120-208CTVU 技术参数

生命周期:Obsolete包装说明:,
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.84
Is Samacsys:N内置保护:TRANSIENT; OVER CURRENT; THERMAL
接口集成电路类型:HALF BRIDGE BASED PERIPHERAL DRIVERJESD-30 代码:R-XXMA-X
功能数量:1最高工作温度:85 °C
最低工作温度:-25 °C输出电流流向:SOURCE AND SINK
标称输出峰值电流:750 A封装主体材料:UNSPECIFIED
封装形状:RECTANGULAR封装形式:MICROELECTRONIC ASSEMBLY
认证状态:Not Qualified标称供电电压:15 V
表面贴装:NO温度等级:OTHER
端子形式:UNSPECIFIED端子位置:UNSPECIFIED
Base Number Matches:1

SKIIP642GB120-208CTVU 数据手册

  
SKiiP 642 GB 120 - 208 CTV  
Absolute Maximum Ratings  
SKiiPPACK  
SK integrated intelligent  
Power PACK  
halfbridge  
Symbol Conditions1)  
Values  
3000  
Units  
V
4)  
Visol  
AC, 1min  
Top ,Tstg  
Operating / stor. temperature  
-25...+85  
°C  
SKiiP  
642 GB 120 - 208 CTV 7,9)  
IGBT and Inverse Diode  
VCES  
1200  
900  
600  
V
V
A
°C  
A
Preliminary Data  
Case S2  
5)  
VCC  
IC  
Tj  
Operating DC link voltage  
IGBT  
IGBT + Diode  
Diode  
3)  
-40...+150  
600  
IF  
IFM  
IFSM  
Diode, tp < 1 ms  
Diode, Tj = 150 °C, 10ms; sin  
1200  
4320  
93  
A
A
I2t (Diode) Diode, Tj = 150 °C, 10ms  
Driver  
kAs2  
VS1  
VS2  
fsmax  
dV/dt  
Stabilized Power Supply  
Non-stabilized Power Supply  
Switching frequency  
18  
30  
20  
75  
V
V
kHz  
kV/µs  
Primary to secondary side  
Characteristics  
Symbol Conditions 1)  
min.  
typ.  
max.  
Units  
Features  
IGBT11)  
V(BR)CES  
Short circuit protection, due to  
evaluation of current sensor  
signals  
Driver without supply  
V
mA  
mA  
VCES  
30  
0,8  
ICES  
VGE = 0,  
Tj = 25 °C  
Tj = 125 °C  
VCE = VCES  
Isolated power supply  
Low thermal impedance  
Optimal thermal management  
with integrated heatsink  
Pressure contact technology  
with increased power cycling  
capability, compact design  
Low stray inductance  
High power, small losses  
Over-temperature protection  
VTO  
rT  
VCesat  
VCesat  
Tj = 125 °C  
Tj = 125 °C  
IC = 500A,  
IC = 500A,  
1,38  
3,7  
3,2  
3,05  
180/293  
V
mΩ  
V
V
mJ  
Tj = 125 °C  
Tj = 25 °C  
Eon + Eoff VCC=600/900V,IC=600A  
Tj = 125 °C  
CCHC  
LCE  
per SkiiP, AC side  
Top, Bottom  
2,8  
7,5  
nF  
nH  
Inverse Diode 2)  
1)  
Theatsink = 25 °C, unless  
VF = VEC IF= 500A;  
Tj = 125 °C  
Tj = 25 °C  
Tj = 125 °C  
2,43  
2,55  
24  
V
V
mJ  
V
0,91  
1,9  
otherwise specified  
CAL = Controlled Axial Lifetime  
VF= VEC  
IF= 500A;  
2)  
Eon + Eoff IF= 600A;  
Technology (soft and fast)  
without driver  
Driver input to DC link/ AC  
3)  
VTO  
rT  
Tj = 125 °C  
Tj = 125 °C  
4)  
mΩ  
output to heatsink  
with Semikron-DC link (low  
inductance)  
other heatsinks on request  
C - Integrated current sensors  
T - Temperature protection  
V - 15 V or 24 V power supply  
AC connection busbars must be  
Thermal Characteristics  
10)  
5)  
Rthjs  
Rthjs  
Rthsa  
per IGBT  
per Diode  
P16 heatsink; see case S2  
0,045  
0,125  
0,044  
°C/W  
°C/W  
°C/W  
10)  
6)  
6,10)  
7)  
Driver  
IS1  
IS2  
Supply current 15V-supply  
Supply current 24V-supply  
Interlock-time  
210+430*fs /fsmax+1,3*IAC/A  
160+290*fs /fsmax+1,0*IAC/A  
3,3  
mA  
mA  
µs  
8)  
tinterlock-driver  
connected by the user; copper  
busbars available on request  
options available for driver:  
U - DC link voltage sense  
F – Fiber optic connector  
s” referenced to temperature  
sensor  
NPT-technology with homo-  
genous current-distribution  
SKiiPPACK protection  
9)  
ITRIPSC  
ITRIPLG  
TTRIP  
Short circuit protection  
A
A
°C  
V
750 ± 2%  
-
Ground fault protection  
Over-temp. protection  
UDC-protection  
115 ± 5%  
920 ± 2%  
10)  
9)  
UDCTRIP  
11)  
Mechanical Data  
M1  
DC terminals, SI Units  
4
8
6
10  
Nm  
Nm  
M2  
AC terminals, SI Units  
by SEMIKRON  
28.01.99  

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