IRF820S, SiHF820S
Vishay Siliconix
Power MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
• Halogen-free According to IEC 61249-2-21
Definition
• Surface Mount
• Available in Tape and Reel
• Dynamic dV/dt Rating
• Repetitive Avalanche Rated
• Fast Switching
• Ease of Paralleling
500
RDS(on) ()
VGS = 10 V
3.0
Qg (Max.) (nC)
24
3.3
Q
Q
gs (nC)
gd (nC)
13
• Simple Drive Requirements
• Compliant to RoHS Directive 2002/95/EC
Configuration
Single
D
DESCRIPTION
D2PAK (TO-263)
Third generation Power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and
cost-effectiveness.
The D2PAK (TO-263) is a surface mount power package
capable of accommodating die size up to HEX-4. It provides
the highest power capability and the lowest possible
on-resistance in any existing surface mount package. The
D2PAK (TO-263) is suitable for high current applications
because of its low internal connection resistance and can
dissipate up to 2.0 W in a typical surface mount application.
G
D
G
S
S
N-Channel MOSFET
ORDERING INFORMATION
Package
D2PAK (TO-263)
SiHF820S-GE3
IRF820SPbF
D2PAK (TO-263)
SiHF820STRL-GE3a
IRF820STRLPbFa
SiHF820STL-E3a
D2PAK (TO-263)
Lead (Pb)-free and Halogen-free
SiHF820STRR-GE3a
IRF820STRRPbFa
SiHF820STR-E3a
Lead (Pb)-free
SiHF820S-E3
Note
a. See device orientation.
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
UNIT
Drain-Source Voltage
Gate-Source Voltage
VDS
VGS
500
20
V
TC = 25 °C
C = 100 °C
2.5
Continuous Drain Current
VGS at 10 V
ID
T
1.6
A
Pulsed Drain Currenta
IDM
8.0
Linear Derating Factor
0.40
0.025
210
W/°C
Linear Derating Factor (PCB Mount)e
Single Pulse Avalanche Energyb
Avalanche Currenta
EAS
IAR
mJ
A
2.5
Repetitive Avalanche Energya
EAR
5.0
mJ
Maximum Power Dissipation
Maximum Power Dissipation (PCB Mount)e
Peak Diode Recovery dV/dtc
TC = 25 °C
50
PD
W
V/ns
°C
TA = 25 °C
3.1
dV/dt
3.5
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
TJ, Tstg
- 55 to + 150
300d
for 10 s
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. VDD = 50 V, starting TJ = 25 °C, L = 60 mH, Rg = 25 , IAS = 2.5 A (see fig. 12).
c. ISD 2.5 A, dI/dt 50 A/μs, VDD VDS, TJ 150 °C.
d. 1.6 mm from case.
e. When mounted on 1" square PCB (FR-4 or G-10 material).
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 91060
S11-1049-Rev. C, 30-May-11
www.vishay.com
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000