Datasheet > SGC251BS

SGC251BS

更新时间： 2024-09-26 01:24:55

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描述
Surface Mount Schottky Rectifier

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中文翻译

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SGC251BS 数据手册

SGC251BS

Surface Mount Schottky Rectifier

Reverse Voltage 100V Forward Current 25A

Features

• Heatsink design

• Schottky barrier diodes

• Low forward voltage drop

• Low leakage current

eSGC (TO‐277)

• Solder dip 260 °C, 10 s

• Low profile - typical height of 1.1 mm

• Moisture sensitivity: level 1, per J-STD-020

• Halogen-free according to IEC 61249-2-21 definition

Anode 1

Cathode

& Heatsink

Anode 2

• High temperature soldering guaranteed: 260℃/10 seconds

Typical Applications

For low voltage high frequency inverters, DC/DC converters and polarity protection application.

Maximum Ratings (TA = 25 °C unless otherwise noted)

SGC251BS

Unit

Parameter

Symbol

Maximum repetitive peak reverse voltage

Maximum RMS voltage

100

VRRM

VRMS

VDC

IF(AV)¹⁾

IF(AV)²⁾

Maximum DC blocking voltage

100

8.0

Maximum average forward rectified current

25.0

Peak forward surge current 8.3 ms single

half sine-wave superimposed on rated load

250

IFSM

Operating junction and storage temperature

range

-55 to +150

TJ, TSTG

°C

Electrical Characteristics (TA = 25 °C unless otherwise noted)

MAX.

Unit

Parameter

Test Conditions

Symbol

I_F=2A

0.42

0.70

250

V_F

Maximum instantaneous forward voltage

T_A=25℃

Volts

I_F=25A

T_A=25℃

T_A=100℃

Maximum DC reverse current at rated DC

blocking voltage

I_R

VR=100V

Typical junction capacitance

4.0 V, 1 MHz

C_J

1.78

juntion to ambient

juntion to mount

℃/W

R_θJA

Typical thermal resistance

℃/W

R_θJM

Notes,1)Thermal resistance RθJA is junction to lead,mounted on P.C.B with 30*30mm copper pad area

2)Thermal resistance R_θJMis junction to mount.Mounted on aluminum substrate P.C.B

www.goodark.com

1/4

2015.01-Rev.A

12 3 4

中文翻译

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