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SBRS8190T3G PDF预览

SBRS8190T3G

更新时间: 2024-11-06 12:27:27
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
4页 132K
描述
Schottky Power Rectifier

SBRS8190T3G 技术参数

是否无铅: 不含铅生命周期:Lifetime Buy
包装说明:R-PDSO-J2针数:2
Reach Compliance Code:not_compliantECCN代码:EAR99
HTS代码:8541.10.00.80风险等级:7.43
其他特性:FREE WHEELING DIODE应用:POWER
配置:SINGLE二极管元件材料:SILICON
二极管类型:RECTIFIER DIODE最大正向电压 (VF):0.75 V
JESD-30 代码:R-PDSO-J2JESD-609代码:e3
最大非重复峰值正向电流:50 A元件数量:1
相数:1端子数量:2
最高工作温度:175 °C最低工作温度:-65 °C
最大输出电流:2 A封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED参考标准:AEC-Q101
最大重复峰值反向电压:90 V最大反向电流:500 µA
反向测试电压:90 V子类别:Rectifier Diodes
表面贴装:YES技术:SCHOTTKY
端子面层:Tin (Sn)端子形式:J BEND
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
Base Number Matches:1

SBRS8190T3G 数据手册

 浏览型号SBRS8190T3G的Datasheet PDF文件第2页浏览型号SBRS8190T3G的Datasheet PDF文件第3页浏览型号SBRS8190T3G的Datasheet PDF文件第4页 
MBRS1100T3G,  
SBRS81100T3G,  
MBRS190T3G,  
SBRS8190T3G  
Preferred Devices  
Schottky Power Rectifier  
http://onsemi.com  
Surface Mount Power Package  
SCHOTTKY BARRIER  
RECTIFIER  
Schottky Power Rectifiers employ the use of the Schottky Barrier  
principle in a large area metal-to-silicon power diode. State-of-the-art  
geometry features epitaxial construction with oxide passivation and  
metal overlay contact. Ideally suited for low voltage, high frequency  
rectification, or as free wheeling and polarity protection diodes, in  
surface mount applications where compact size and weight are critical  
to the system. These state-of-the-art devices have the following  
features:  
1.0 AMPERE  
90, 100 VOLTS  
Features  
SMB  
Small Compact Surface Mountable Package with J-Bend Leads  
Rectangular Package for Automated Handling  
Highly Stable Oxide Passivated Junction  
High Blocking Voltage 100 Volts  
CASE 403A  
MARKING DIAGRAM  
175C Operating Junction Temperature  
Guardring for Stress Protection  
AECQ101 Qualified and PPAP Capable  
SBRS8 Prefix for Automotive and Other Applications Requiring  
Unique Site and Control Change Requirements  
All Packages are PbFree*  
AYWW  
B1xG  
G
B1 = Device Code  
x
= C for MBRS1100T3  
9 for MBRS190T3  
= Assembly Location  
= Year  
Mechanical Characteristics  
Case: Epoxy, Molded  
Weight: 95 mg (approximately)  
Finish: All External Surfaces Corrosion Resistant and Terminal  
Leads are Readily Solderable  
A
Y
WW = Work Week  
G
= PbFree Package  
(Note: Microdot may be in either location)  
Lead and Mounting Surface Temperature for Soldering Purposes:  
260C Max. for 10 Seconds  
Shipped in 12 mm Tape and Reel, 2,500 units per reel  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 2 of this data sheet.  
Cathode Polarity Band  
Preferred devices are recommended choices for future use  
and best overall value.  
*For additional information on our PbFree strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
Semiconductor Components Industries, LLC, 2012  
1
Publication Order Number:  
January, 2012 Rev. 10  
MBRS1100T3/D  

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