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SB2520FCT_09 PDF预览

SB2520FCT_09

更新时间: 2024-11-13 08:53:59
品牌 Logo 应用领域
强茂 - PANJIT /
页数 文件大小 规格书
2页 88K
描述
SCHOTTKY BARRIER RECTIFIERS

SB2520FCT_09 数据手册

 浏览型号SB2520FCT_09的Datasheet PDF文件第2页 
SB2520FCT~SB2560FCT  
SCHOTTKY BARRIER RECTIFIERS  
25 Amperes  
VOLTAGE  
CURRENT  
20 to 60 Volts  
FEATURES  
• Plastic package has Underwriters Laboratory  
Flammability Classification 94V-O.  
Flame Retardant Epoxy Molding Compound.  
• Exceeds environmental standards of MIL-S-19500/228  
• Low power loss, high efficiency.  
• Low forwrd voltge, high current capability  
• High surge capacity.  
• For use in low voltage,high frequency inverters  
free wheeling , and polarlity protection applications.  
• In compliance with EU RoHS 2002/95/EC directives  
MECHANCEALDATA  
• Case: ITO-220AB full Molded plastic  
Terminals: Solder plated, solderable per MIL-STD-750, Method 2026  
• Polarity: As marked.  
.027(.67)  
.022(.57)  
• Standard packaging: Any  
• Weight: 0.055 ounces, 1.5615 grams.  
MAXIMUMRATINGSANDELECTRICALCHARACTERISTICS  
Ratings at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load.  
For capacitive load, derate current by 20%  
SB2520FCT SB2530FCT SB2540FCT SB2545FCT SB2550FCT SB2560FCT  
PARAMETER  
SYMBOL  
VRRM  
UNITS  
V
Maximum Recurrent Peak Reverse Voltage  
20  
14  
20  
30  
21  
30  
40  
28  
40  
45  
31.5  
45  
50  
35  
50  
60  
42  
60  
Maximum RMS Voltage  
VRMS  
VDC  
IF(AV)  
IFSM  
VF  
V
V
A
A
V
Maximum DC Blocking Voltage  
Maximum Average Forward Current at Tc =75O  
C
25.0  
200  
Peak Forward Surge Current :8.3ms single half sine-  
wave superimposed on rated load(JEDEC method)  
Maximum Forward Voltage at 12.5A, per leg  
Maximum DC Reverse Current TJ=25 OC  
0.55  
0.75  
0.2  
0.1  
IR  
mA  
at Rated DC Blocking Voltage TJ=100O  
C
100  
100  
Typical Thermal Resistance  
RθJC  
2
OC / W  
OC  
Operating Junction Temperature Range  
Storage Temperature Range  
TJ  
-55 to +125  
-55 to +150  
TSTG  
-55 to +150  
OC  
NOTES:  
Both Bonding and Chip structure are available.  
PAGE . 1  
STAD-APR.27.2009  
1

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