128Mb: x4, x8, x16
SDRAM 3.3V
ICC OPERATING CONDITIONS AND MAXIMUM LIMITS: Vdd = 3.3V ± 10%V, Temp. = 25° to 70 °C
Supply Current
OPERATING CURRENT: ACTIVE mode, burst = 1, READ or WRITE, tRC > tRC
(MIN), one bank active, CL=3
Symbol
Icc1
-75A
165
-8A
140
Units
mA
Notes
1, 2, 3, 4
STANDBY CURRENT: POWER-DOWN mode, CKE = LOW,
Standard parts
Idd2
9
9
mA
32
no accesses in progress
Self refresh parts
Idd2
Icc3
Icc4
3
75
75
3
60
50
mA
mA
mA
32
1, 2, 3, 4
1, 2, 3, 4
STANDBY CURRENT: CS# = HIGH, CKE = HIGH, all banks idle
STANDBY CURRENT: CS# = HIGH, CKE = HIGH, all banks active after tRCD met,
no accesses in progress.
OPERATING CURRENT: BURST mode after tRCD met, continuous burst, READ,
WRITE, all banks active, CL=3
Icc5
165
145
mA
1, 2, 3, 4
AUTO REFRESH CURRENT tRC > tRC (MIN)
AUTO REFRESH CURRENT tRC=15.6us
SELF REFRESH CURRENT (Self refresh parts only, part M)
CL = 3
CL = 3
Icc6
Icc7
Idd8
265
50
3
245
50
3
mA
mA
mA
1, 2, 3, 4
1, 2, 3, 4
Notes
1. All voltages referenced to Vss.
2. An initial pause of 100 ms is required after power-up, followed by two AUTO REFRESH commands, before proper device operation
is ensure. (Vdd and VddQ must be powered-up simultaneously Vss and VssQ must be at the same potential.) The two AUTO
REFRESH command wake-ups should be repeated any time the tREF refresh requirement is exceeded.
3. Icc specifications are tested after the device is properly initialized. tCK= 10ns for –8 and tCK=7.5ns for –75A.
PDF: 09005aef807827f6 / Source: 09005aef807825bd
128Mb SDRAM
Rev: 11/29/2004
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specifications without notice. Ó 2001, 2002, 2004 SpecTek
3
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