S3AB thru S3MB
SURFACE MOUNT
GLASS PASSIVATED RECTIFIERS
REVERSE VOLTAGE
POWER DISSIPATION
- 50 to 1000Volts
- 3.0 Amperes
FEATURES
● Glass passivated chip
SMB
● For surface mounted applications
● Low reverse leakage current
● Low forward voltage drop
.083(2.11)
.075(1.91)
.155(3.94)
.130(3.30)
● High current capability
● Plastic material has UL flammability
.185(4.70)
.160(4.06)
classification 94V-0
.012(.305)
.006(.152)
.096(2.44)
.084(2.13)
MECHANICAL DATA
●Case: Molded Plastic
●Polarity:Color band denotes cathode
●Weight: 0.003 ounces,0.093 grams
●Mounting position: Any
.008(.203)
.002(.051)
.060(1.52)
.030(0.76)
.220(5.59)
.200(5.08)
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Rating at 25℃ ambient temperature unless otherwise specified.
Single phase, half wave ,60Hz, resistive or inductive load.
For capacitive load, derate current by 20%
SYMBOL S3AB
S3BB
100
70
S3DB
200
S3GB
400
S3JB
600
S3KB
800
S3MB
1000
700
UNIT
CHARACTERISTICS
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Voltage
VRRM
VRMS
VDC
50
35
50
V
V
V
140
280
420
560
Maximum DC Blocking Voltage
100
200
400
600
800
1000
Maximum Average Forward
I(AV)
3.0
A
Rectified Current
@TL=75 ℃
Peak Forward Surge Current
8.3ms Single Half Sine-Wave
Super Imposed On Rated Load (JEDEC Method)
IFSM
200
1.2
A
Maximum Forward Voltage at 3.0A DC
VF
IR
V
5.0
Maximum DC Reverse Current
at Rated DC Blocking Voltage
@TJ=25℃
uA
250
@TJ=100℃
40
10
Typical Junction Capacitance (Note1)
Typical Thermal Resistance (Note2)
Typical Thermal Resistance (Note3)
Operating Temperature Range
CJ
RθJL
RθJA
TJ
pF
℃/W
℃/W
℃
50
-55 to +150
-55 to +150
Storage Temperature Range
TSTG
℃
NOTES:1.Measured at 1.0 MHz and applied reverse voltage of 4.0V DC.
2.Thermal resistance junction to lead.
3.Thermal resistance junction to ambient.
~ 33 ~