S3AB - S3MB
3.0 AMPS. Surface Mount Rectifiers
SMB/DO-214AA
.083(2.10)
.077(1.95)
.147(3.73)
.137(3.48)
Features
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For surface mounted application
Glass passivated junction chip.
Low forward voltage drop
High current capability
Easy pick and place
High surge current capability
Plastic material used carries Underwriters
Laboratory Classification 94V-0
High temperature soldering:
260oC / 10 seconds at terminals
.187(4.75)
.167(4.25)
.012(.31)
.006(.15)
.103(2.61)
.078(1.99)
.012(.31)
.006(.15)
.056(1.41)
.035(0.90)
.008(.20)
.004(.10)
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.209(5.30)
.201(5.10)
Mechanical Data
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Case: Molded plastic
Dimensions in inches and (millimeters)
Terminals: Pure tin plated, lead free.
Polarity: Indicated by cathode band
Packaging: 16mm tape per EIA STD RS-481
Weight: 0.093 gram
Maximum Ratings and Electrical Characteristics
Rating at 25 oC ambient temperature unless otherwise specified.
Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%
Type Number
Symbol S3AB S3BB S3DB S3GB S3JB S3KB S3MB Units
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Voltage
VRRM
VRMS
VDC
50
35
50
100 200 400 600 800 1000
70 140 280 420 560 700
V
V
V
Maximum DC Blocking Voltage
100 200 400 600 800 1000
Maximum Average Forward Rectified Current
@TL =75 oC
I(AV)
3.0
A
A
V
Peak Forward Surge Current, 8.3 ms Single
Half Sine-wave Superimposed on Rated
Load (JEDEC method )
IFSM
80
Maximum Instantaneous Forward Voltage
@ 3.0A
VF
IR
1.15
Maximum DC Reverse Current @ TA =25 oC
10
250
uA
uA
at Rated DC Blocking Voltage @ TA=125 oC
Maximum Reverse Recovery Time ( Note 1 )
Typical Junction Capacitance ( Note 2 )
Typical Thermal Resistance (Note 3)
Operating Temperature Range
Trr
Cj
2.5
40
uS
pF
R
10
oC/W
oC
θJL
TJ
-55 to +150
-55 to +150
Storage Temperature Range
TSTG
oC
1. Reverse Recovery Test Conditions: IF=0.5A, IR=1.0A, IRR=0.25A
2. Measured at 1 MHz and Applied VR=4.0 Volts
Notes:
3. Measured on P.C. Board with 0.4” x 0.4” (10mm x 10mm) Copper Pad Areas.
Version: B07
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