S32K3XX
S32K3xx Data Sheet
Supports S32K344, S32K324, S32K314, S32K312, S32K311, S32K310,
S32K341, S32K342 and S32K322. Data is preliminary for S32K328, S32K338,
S32K348, S32K358 and S32K388
Rev. 8.1 — 11/2023
Data Sheet: Technical Data
• Operating characteristics
• Memory and memory interfaces
— Voltage range: 2.97 V to 5.5 V
— Up to 8 MB program flash memory with ECC
— Ambient temperature range: -40 °C to 125 °C for all
power modes
— Up to 128 K of flexible program or data flash
memory
™
• Arm Cortex-M7 core, 32-bit CPU
— Up to 512 KB SRAM with ECC, includes 192 KB of
TCM RAM ensuring maximum CPU performance of
fast control loops with minimal latency
— M7 supports up to 320 MHz frequency with 2.14
DMIPS / MHz
— Data and instruction cache for each core to
minimize performance impact of memory access
latencies
®
— Arm Core based on the Armv7 and Thumb -2 ISA
— Integrated Digital Signal Processor (DSP)
— Configurable Nested Vectored Interrupt Controller
(NVIC)
— QuadSPI support
• Mixed-signal analog
— Single Precision Floating Point Unit (FPU)
• Clock interfaces
— Up to three 12-bit Analog-to-Digital Converters
(ADC) with up to 24 channel analog inputs per
module
— 8 - 40 MHz Fast External Oscillator (FXOSC)
— 48 MHz Fast Internal RC oscillator (FIRC)
— 32 kHz Low Power Oscillator (SIRC)
— 32 kHz Slow External Oscillator (SXOSC)
— System Phased Lock Loop (SPLL)
• I/O and package
— One Temperature Sensor (TempSense)
— Up to three Analog Comparators (CMP), with each
comparator having an internal 8-bit DAC
• Human-Machine Interface (HMI)
— Up to 235 GPIO pins
— Non-Maskable Interrupt (NMI)
— Up to 60 pins with wakeup capability
— Up to 32 pins with interrupt support
— LQFP48, HDQFP100, HDQFP172, MAPBGA257,
MAPBGA289, HDQFP172 with Exposed pad (EP)
package options
• Up to 32-channel DMA with up to 128 request sources
using DMAMUX
NXP reserves the right to change the detail specifications as may be required to
permit improvements in the design of its products.