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S29WS128P0LBAW000 PDF预览

S29WS128P0LBAW000

更新时间: 2024-11-05 03:44:27
品牌 Logo 应用领域
飞索 - SPANSION 闪存
页数 文件大小 规格书
89页 1623K
描述
512/256/128 Mb (32/16/8 M x 16 bit) 1.8 V Burst Simultaneous Read/Write MirrorBit Flash Memory

S29WS128P0LBAW000 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred零件包装代码:BGA
包装说明:VFBGA, BGA84,10X12,32针数:84
Reach Compliance Code:compliantECCN代码:3A991.B.1.A
HTS代码:8542.32.00.51风险等级:5.44
最长访问时间:80 ns其他特性:SYNCHRONOUS BURST MODE OPERATION POSSIBLE
启动块:BOTTOM/TOP命令用户界面:YES
通用闪存接口:YES数据轮询:YES
JESD-30 代码:R-PBGA-B84JESD-609代码:e1
长度:11.6 mm内存密度:134217728 bit
内存集成电路类型:FLASH内存宽度:16
湿度敏感等级:3功能数量:1
部门数/规模:8,126端子数量:84
字数:8388608 words字数代码:8000000
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-25 °C组织:8MX16
封装主体材料:PLASTIC/EPOXY封装代码:VFBGA
封装等效代码:BGA84,10X12,32封装形状:RECTANGULAR
封装形式:GRID ARRAY, VERY THIN PROFILE, FINE PITCH页面大小:8 words
并行/串行:PARALLEL峰值回流温度(摄氏度):260
电源:1.8 V编程电压:1.8 V
认证状态:Not Qualified就绪/忙碌:YES
座面最大高度:1 mm部门规模:16K,64K
最大待机电流:0.000005 A子类别:Flash Memories
最大压摆率:0.08 mA最大供电电压 (Vsup):1.95 V
最小供电电压 (Vsup):1.7 V标称供电电压 (Vsup):1.8 V
表面贴装:YES技术:CMOS
温度等级:OTHER端子面层:TIN SILVER COPPER
端子形式:BALL端子节距:0.8 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:40
切换位:YES类型:NOR TYPE
宽度:8 mmBase Number Matches:1

S29WS128P0LBAW000 数据手册

 浏览型号S29WS128P0LBAW000的Datasheet PDF文件第2页浏览型号S29WS128P0LBAW000的Datasheet PDF文件第3页浏览型号S29WS128P0LBAW000的Datasheet PDF文件第4页浏览型号S29WS128P0LBAW000的Datasheet PDF文件第5页浏览型号S29WS128P0LBAW000的Datasheet PDF文件第6页浏览型号S29WS128P0LBAW000的Datasheet PDF文件第7页 
S29WS-P  
MirrorBitFlash Family  
S29WS512P, S29WS256P, S29WS128P  
512/256/128 Mb (32/16/8 M x 16 bit)  
1.8 V Burst Simultaneous Read/Write MirrorBit Flash Memory  
S29WS-P Cover Sheet  
Data Sheet (Advance Information)  
Notice to Readers: This document states the current technical specifications regarding the Spansion  
product(s) described herein. Each product described herein may be designated as Advance Information,  
Preliminary, or Full Production. See Notice On Data Sheet Designations for definitions.  
Publication Number S29WS-P_00  
Revision A  
Amendment 7  
Issue Date November 8, 2006  

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