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S29GL128P90TAIV10 PDF预览

S29GL128P90TAIV10

更新时间: 2024-01-24 09:08:43
品牌 Logo 应用领域
飞索 - SPANSION 闪存
页数 文件大小 规格书
77页 2742K
描述
3.0 Volt-only Page Mode Flash Memory featuring 90 nm MirrorBit Process Technology

S29GL128P90TAIV10 技术参数

生命周期:Transferred零件包装代码:TSOP1
包装说明:HTSSOP,针数:56
Reach Compliance Code:unknownECCN代码:3A991.B.1.A
HTS代码:8542.32.00.51风险等级:5.71
最长访问时间:90 nsJESD-30 代码:R-PDSO-G56
长度:18.4 mm内存密度:134217728 bit
内存集成电路类型:FLASH内存宽度:1
功能数量:1端子数量:56
字数:134217728 words字数代码:128000000
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:128MX1
封装主体材料:PLASTIC/EPOXY封装代码:HTSSOP
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
并行/串行:PARALLEL编程电压:3 V
认证状态:Not Qualified座面最大高度:1.2 mm
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):2.7 V
标称供电电压 (Vsup):3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子形式:GULL WING端子节距:0.5 mm
端子位置:DUAL类型:NOR TYPE
宽度:14 mmBase Number Matches:1

S29GL128P90TAIV10 数据手册

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D a t a S h e e t ( P r e l i m i n a r y )  
Colophon  
The products described in this document are designed, developed and manufactured as contemplated for general use, including without  
limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as  
contemplated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the  
public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility,  
aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for  
any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion will not be liable to  
you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor  
devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design  
measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal  
operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under  
the Foreign Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country,  
the prior authorization by the respective government entity will be required for export of those products.  
Trademarks and Notice  
The contents of this document are subject to change without notice. This document may contain information on a Spansion product under  
development by Spansion. Spansion reserves the right to change or discontinue work on any product without notice. The information in this  
document is provided as is without warranty or guarantee of any kind as to its accuracy, completeness, operability, fitness for particular purpose,  
merchantability, non-infringement of third-party rights, or any other warranty, express, implied, or statutory. Spansion assumes no liability for any  
damages of any kind arising out of the use of the information in this document.  
Copyright © 2004–2007 Spansion Inc. All rights reserved. Spansion®, the Spansion Logo, MirrorBit®, MirrorBit® Eclipse, ORNAND, HD-  
SIMand combinations thereof, are trademarks of Spansion LLC in the US and other countries. Other names used are for informational  
purposes only and may be trademarks of their respective owners.  
November 8, 2007 S29GL-P_00_A7  
S29GL-P MirrorBit® Flash Family  
77  

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