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S29CD016J0PQAI133 PDF预览

S29CD016J0PQAI133

更新时间: 2024-02-13 02:00:42
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 内存集成电路闪存
页数 文件大小 规格书
89页 1244K
描述
Flash, 512KX32, 54ns, PQFP80, QFP-80

S29CD016J0PQAI133 技术参数

是否Rohs认证: 不符合生命周期:Active
包装说明:QFP-80Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8542.32.00.51
风险等级:5.04最长访问时间:54 ns
其他特性:SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK启动块:BOTTOM
命令用户界面:YES通用闪存接口:YES
数据轮询:YESJESD-30 代码:R-PQFP-G80
JESD-609代码:e0长度:20 mm
内存密度:16777216 bit内存集成电路类型:FLASH
内存宽度:32湿度敏感等级:3
功能数量:1部门数/规模:16,30
端子数量:80字数:524288 words
字数代码:512000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:512KX32封装主体材料:PLASTIC/EPOXY
封装代码:QFP封装等效代码:QFP80,.7X.9,32
封装形状:RECTANGULAR封装形式:FLATPACK
并行/串行:PARALLEL峰值回流温度(摄氏度):240
电源:1.8/2.6,2.6 V编程电压:2.7 V
认证状态:Not Qualified就绪/忙碌:YES
座面最大高度:3.35 mm部门规模:2K,16K
最大待机电流:0.00006 A子类别:Flash Memories
最大压摆率:0.09 mA最大供电电压 (Vsup):2.75 V
最小供电电压 (Vsup):2.5 V标称供电电压 (Vsup):2.6 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:GULL WING端子节距:0.8 mm
端子位置:QUAD处于峰值回流温度下的最长时间:30
切换位:YES类型:NOR TYPE
宽度:14 mmBase Number Matches:1

S29CD016J0PQAI133 数据手册

 浏览型号S29CD016J0PQAI133的Datasheet PDF文件第1页浏览型号S29CD016J0PQAI133的Datasheet PDF文件第2页浏览型号S29CD016J0PQAI133的Datasheet PDF文件第4页浏览型号S29CD016J0PQAI133的Datasheet PDF文件第5页浏览型号S29CD016J0PQAI133的Datasheet PDF文件第6页浏览型号S29CD016J0PQAI133的Datasheet PDF文件第7页 
S29CD032J  
S29CD016J  
S29CL032J  
S29CL016J  
Contents  
1.  
Ordering Information................................................... 4  
13. Electrical Specifications............................................. 51  
1.1 Valid Combinations........................................................ 5  
13.1 Absolute Maximum Ratings.......................................... 51  
2.  
3.  
4.  
5.  
Input/Output Descriptions and Logic Symbols......... 6  
Block Diagram.............................................................. 7  
Block Diagram of Simultaneous Read/Write Circuit. 8  
Physical Dimensions/Connection Diagrams............. 9  
14. Operating Ranges....................................................... 52  
15. DC Characteristics...................................................... 52  
15.1 Zero Power Flash.......................................................... 53  
16. Test Conditions........................................................... 54  
5.1 80-Pin PQFP Connection Diagram................................ 9  
5.2 PQR080–80-Lead Plastic Quad Flat Package Physical Di-  
mensions...................................................................... 10  
5.3 80-Ball Fortified BGA Connection Diagrams................ 11  
5.4 Special Package Handling Instructions........................ 11  
5.5 LAA080–80-ball Fortified Ball Grid Array (13 x 11 mm)  
Physical Dimensions.................................................... 12  
5.6 LAD080–80-ball Fortified Ball Grid Array (11 x 9 mm)  
Physical Dimensions.................................................... 13  
17. Test Specifications ..................................................... 54  
17.1 Switching Waveforms ................................................... 55  
18. AC Characteristics...................................................... 56  
18.1 VCC and VIO Power-up.................................................. 56  
18.2 Asynchronous Operations............................................. 57  
18.3 Synchronous Operations .............................................. 59  
18.4 Hardware Reset (RESET#)........................................... 61  
18.5 Write Protect (WP#)...................................................... 62  
18.6 Erase/Program Operations........................................... 62  
18.7 Alternate CE# Controlled Erase/Program Operations .. 69  
18.8 Erase and Programming Performance ......................... 71  
18.9 PQFP and Fortified BGA Pin Capacitance ................... 71  
6.  
Additional Resources................................................ 14  
6.1 Application Notes......................................................... 14  
6.2 Specification Bulletins.................................................. 14  
6.3 Hardware and Software Support.................................. 14  
6.4 Contacting Cypress...................................................... 14  
19. Appendix 1 .................................................................. 72  
19.1 Common Flash Memory Interface (CFI) ....................... 72  
7.  
7.1 Memory Map................................................................ 15  
8. Device Operations ..................................................... 21  
Product Overview ...................................................... 15  
20. Appendix 2 .................................................................. 76  
20.1 Command Definitions.................................................... 76  
21. Revision History.......................................................... 80  
8.1 Device Operation Table ............................................... 22  
8.2 Asynchronous Read..................................................... 23  
8.3 Hardware Reset (RESET#).......................................... 23  
8.4 Synchronous (Burst) Read Mode and Configuration Regis-  
ter................................................................................. 24  
8.5 Autoselect .................................................................... 29  
8.6 VersatileI/O (VIO) Control............................................. 29  
8.7 Program/Erase Operations .......................................... 30  
8.8 Write Operation Status................................................. 35  
8.9 Reset Command.......................................................... 41  
9.  
Advanced Sector Protection/Unprotection ............. 41  
9.1 Advanced Sector Protection Overview ........................ 43  
9.2 Persistent Protection Bits............................................. 43  
9.3 Persistent Protection Bit Lock Bit................................. 45  
9.4 Dynamic Protection Bits............................................... 45  
9.5 Password Protection Method....................................... 46  
9.6 Hardware Data Protection Methods............................. 47  
10. Secured Silicon Sector Flash Memory Region ....... 48  
10.1 Secured Silicon Sector Protection Bit .......................... 49  
10.2 Secured Silicon Sector Entry and Exit Commands...... 49  
11. Electronic Marking..................................................... 49  
12. Power Conservation Modes...................................... 49  
12.1 Standby Mode.............................................................. 49  
12.2 Automatic Sleep Mode................................................. 50  
12.3 Hardware RESET# Input Operation............................. 50  
12.4 Output Disable (OE#)................................................... 50  
Document Number: 002-00948 Rev. *B  
Page 3 of 89  

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