SPICE MODELS: RS3A RS3B RS3D RS3G RS3J RS3K RS3M RS3AB RS3BB RS3DB RS3GB RS3JB RS3KB RS3MB
RS3A/B - RS3M/B
3.0A SURFACE MOUNT FAST RECOVERY RECTIFIER
Features
·
·
·
·
·
Glass Passivated Die Construction
Fast Recovery Time for High Efficiency
Surge Overload Rating to 100A Peak
Ideally Suited for Automatic Assembly
Lead Free Finish/RoHS Compliant (Note 4)
SMB
Min
SMC
Min
B
Dim
Max
3.94
4.57
2.21
0.31
5.59
0.20
1.52
2.62
Max
6.22
7.11
3.18
0.31
8.13
0.20
1.52
2.62
A
B
C
D
E
G
H
J
3.30
4.06
1.96
0.15
5.00
0.10
0.76
2.00
5.59
6.60
2.75
0.15
7.75
0.10
0.76
2.00
A
C
Mechanical Data
·
Case: SMB, SMC
D
·
Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
J
·
·
Moisture Sensitivity: Level 1 per J-STD-020C
G
H
Terminals: Lead Free Plating (Matte Tin Finish).
Solderable per MIL-STD-202, Method 208
E
e3
All Dimensions in mm
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·
·
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Polarity: Cathode Band or Cathode Notch
Marking Information: See Page 3
Ordering Information: See Page 3
AB, BB, DB, GB, JB, KB, MB Suffix Designates SMB Package
A, B, D, G, J, K, M Suffix Designates SMC Package
Weight: SMB 0.093 grams (approx)
SMC 0.21 grams (approx)
@ TA = 25°C unless otherwise specified
Maximum Ratings and Electrical Characteristics
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
RS3
A/AB
RS3
B/BB
RS3
RS3
RS3
J/JB
RS3
RS3
Characteristic
Symbol
Unit
D/DB G/GB
K/KB M/MB
VRRM
VRWM
VR
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage (Note 5)
50
35
100
70
200
140
400
600
420
800
560
1000
700
V
VR(RMS)
IO
RMS Reverse Voltage
280
3.0
V
A
Average Rectified Output Current
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine-wave Superimposed on Rated Load
@ TT = 75°C
IFSM
VFM
IRM
100
A
V
Forward Voltage
@ IF = 3.0A
1.3
5.0
250
Peak Reverse Current
at Rated DC Blocking Voltage (Note 5)
@ TA = 25°C
@ TA = 125°C
mA
trr
Maximum Recovery Time (Note 3)
Typical Total Capacitance (Note 2)
150
250
500
ns
pF
CT
50
25
R
qJT
Typical Thermal Resistance Junction to Terminal (Note 1)
Operating and Storage Temperature Range
°C/W
°C
Tj, TSTG
-65 to +150
2
Notes:
1. Thermal resistance: junction to terminal, unit mounted on PC board with 5.0 mm (0.013 mm thick) copper pad as heat sink.
2. Measured at 1.0MHz and applied reverse voltage of 4.0V DC.
3. Reverse recovery test conditions: I = 0.5A, I = 1.0A, I = 0.25A. See figure 5.
F
R
rr
4. RoHS revision 13.2.2003. Glass and high temperature solder exemptions applied, see EU Directive Annex Notes 5 and 7.
5. Short duration pulse test used to minimize self-heating effect.
DS15005 Rev. 8 - 2
1 of 3
RS3A/B - RS3M/B
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