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RK80532PC064512 PDF预览

RK80532PC064512

更新时间: 2024-01-29 07:15:01
品牌 Logo 应用领域
其他 - ETC 外围集成电路微处理器时钟
页数 文件大小 规格书
85页 1952K
描述
Microprocessor

RK80532PC064512 技术参数

生命周期:Active零件包装代码:PGA
包装说明:SPGA,针数:478
Reach Compliance Code:unknown风险等级:5.76
Is Samacsys:N地址总线宽度:36
位大小:32边界扫描:YES
最大时钟频率:200 MHz外部数据总线宽度:64
格式:FLOATING POINT集成缓存:YES
JESD-30 代码:S-CPGA-P478长度:35 mm
低功率模式:YES端子数量:478
封装主体材料:CERAMIC, METAL-SEALED COFIRED封装代码:SPGA
封装形状:SQUARE封装形式:GRID ARRAY, SHRINK PITCH
认证状态:COMMERCIAL速度:2600 MHz
最大供电电压:1.4 V最小供电电压:1.32 V
表面贴装:NO端子面层:NOT SPECIFIED
端子形式:PIN/PEG端子节距:1.27 mm
端子位置:PERPENDICULAR宽度:35 mm
uPs/uCs/外围集成电路类型:MICROPROCESSORBase Number Matches:1

RK80532PC064512 数据手册

 浏览型号RK80532PC064512的Datasheet PDF文件第2页浏览型号RK80532PC064512的Datasheet PDF文件第3页浏览型号RK80532PC064512的Datasheet PDF文件第4页浏览型号RK80532PC064512的Datasheet PDF文件第6页浏览型号RK80532PC064512的Datasheet PDF文件第7页浏览型号RK80532PC064512的Datasheet PDF文件第8页 
Figures  
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VCCVID Pin Voltage and Current Requirements................................................13  
Typical VCCIOPLL, VCCA and VSSA Power Distribution ..................................15  
Phase Lock Loop (PLL) Filter Requirements ......................................................15  
Vcc Static and Transient Tolerance ....................................................................23  
ITPCLKOUT[1:0] Output Buffer Diagram ............................................................26  
Test Circuit .........................................................................................................27  
Exploded View of Processor Components on a System Board ..........................29  
Processor Package .............................................................................................30  
Processor Cross-Section and Keep-In................................................................31  
Processor Pin Detail............................................................................................31  
IHS Flatness Specification ..................................................................................32  
Processor Markings.............................................................................................34  
The Coordinates of the Processor Pins As Viewed from the  
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Top of the Package .............................................................................................35  
Example Thermal Solution (Not to scale)............................................................62  
Guideline Locations for Case Temperature (TCASE)  
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Thermocouple Placement ...................................................................................64  
Stop Clock State Machine...................................................................................66  
Mechanical Representation of the Boxed Processor ..........................................71  
Side View Space Requirements for the Boxed Processor ..................................72  
Top View Space Requirements for the Boxed Processor ...................................73  
Boxed Processor Fan Heatsink Power Cable Connector Description.................75  
MotherBoard Power Header Placement Relative to Processor Socket ..............76  
Boxed Processor Fan Heatsink Airspace Keep-Out Requirements  
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(side 1 view) ........................................................................................................77  
Boxed Processor Fan Heatsink Airspace Keep-Out Requirements  
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(side 2 view) ........................................................................................................77  
Boxed Processor Fan Heatsink Set Points .........................................................78  
Datasheet  
5

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