RF1S530SM
Data Sheet
February 2001
File Number 1575.8
14A, 100V, 0.160 Ohm, N-Channel Power
MOSFETs
Features
• 14A, 100V
[ /Title These are N-Channel enhancement mode silicon gate
• r = 0.160Ω
DS(ON)
power field effect transistors. They are advanced power
(RF1S
530SM
)
• Single Pulse Avalanche Energy Rated
• SOA is Power Dissipation Limited
• Nanosecond Switching Speeds
• Linear Transfer Characteristics
• High Input Impedance
MOSFETs designed, tested, and guaranteed to withstand a
specified level of energy in the breakdown avalanche mode
of operation. All of these power MOSFETs are designed for
applications such as switching regulators, switching
/Sub-
ject
convertors, motor drivers, relay drivers, and drivers for high
power bipolar switching transistors requiring high speed and
low gate drive power. These types can be operated directly
from integrated circuits.
(14A,
100V,
0.160
Ohm,
N-
• Related Literature
- TB334 “Guidelines for Soldering Surface Mount
Components to PC Boards”
Formerly developmental type TA17411.
Ordering Information
Symbol
Chan-
nel
D
PART NUMBER
PACKAGE
BRAND
RF1S530
Power
MOS-
FETs)
/Autho
r ()
RF1S530SM
TO-263AB
NOTE: When ordering, use the entire part number. Add the suffix 9A
to obtain the TO-263AB variant in the tape and reel, i.e.,
RF1S530SM9A.
G
S
/Key-
words
(14A,
100V,
0.160
Ohm,
N-
Packaging
JEDEC TO-263AB
DRAIN
(FLANGE)
GATE
SOURCE
Chan-
nel
o
Absolute Maximum Ratings
T
= 25 C, Unless Otherwise Specified
C
Power
MOS-
FETs,
Inter-
sil
Corpo-
ration,
TO-
263AB
)
/Cre-
ator ()
RF1S530SM
UNITS
Drain to Source Breakdown Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
100
100
14
10
56
V
V
A
A
A
V
W
DS
Drain to Gate Voltage (R
= 20kΩ) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
GS
DGR
Continuous Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
D
D
o
T
= 100 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
C
Pulsed Drain Current (Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
DM
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
20
79
0.53
69
-55 to 175
GS
Maximum Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .P
Dissipation Derating Factor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Single Pulse Avalanche Energy Rating (Note 4). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .E
D
o
W/ C
mJ
AS
o
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
Maximum Temperature for Soldering
T
C
J, STG
o
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
300
260
C
L
o
Package Body for 10s, See Techbrief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
C
pkg
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
o
o
1. T = 25 C to 150 C.
J
©2001 Fairchild Semiconductor Corporation
RF1S530SM Rev. A