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R5F213M6UNNP_11 PDF预览

R5F213M6UNNP_11

更新时间: 2024-11-04 07:20:15
品牌 Logo 应用领域
瑞萨 - RENESAS /
页数 文件大小 规格书
93页 800K
描述
RENESAS MCU

R5F213M6UNNP_11 数据手册

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Datasheet  
R8C/3MU Group, R8C/3MK Group  
RENESAS MCU  
R01DS0112EJ0110  
Rev.1.10  
Jun 15, 2011  
1. Overview  
1.1  
Features  
The R8C/3MU Group, R8C/3MK Group of single-chip MCUs incorporates the R8C CPU core, employing  
sophisticated instructions for a high level of efficiency. With 1 Mbyte of address space, and it is capable of  
executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation  
processing.  
Power consumption is low, and the supported operating modes allow additional power control. These MCUs are  
designed to maximize EMI/EMS performance.  
Integration of many peripheral functions, including multifunction timer and serial interface, reduces the number of  
system components.  
The R8C/3MU Group, R8C/3MK Group has data flash (1 KB × 4 blocks) with the background operation (BGO)  
function.  
1.1.1  
Applications  
Peripherals (USB applicable), audio components, cameras, televisions, household appliances, office equipment,  
communication devices, mobile devices, industrial equipment, and other applications.  
R01DS0112EJ0110 Rev.1.10  
Jun 15, 2011  
Page 1 of 88  

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