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R5F213M8UNNP PDF预览

R5F213M8UNNP

更新时间: 2024-11-04 07:20:15
品牌 Logo 应用领域
瑞萨 - RENESAS /
页数 文件大小 规格书
93页 800K
描述
RENESAS MCU

R5F213M8UNNP 技术参数

生命周期:Obsolete零件包装代码:QFN
包装说明:QCCN, LCC40,.24SQ,20针数:40
Reach Compliance Code:compliant风险等级:5.78
位大小:16JESD-30 代码:S-PQCC-N40
端子数量:40最高工作温度:85 °C
最低工作温度:-20 °C封装主体材料:PLASTIC/EPOXY
封装代码:QCCN封装等效代码:LCC40,.24SQ,20
封装形状:SQUARE封装形式:CHIP CARRIER
电源:2/5 V认证状态:Not Qualified
RAM(字节):8192ROM(单词):65536
ROM可编程性:FLASH速度:20 MHz
子类别:Microcontrollers最大压摆率:15 mA
表面贴装:YES技术:CMOS
温度等级:OTHER端子形式:NO LEAD
端子节距:0.5 mm端子位置:QUAD
Base Number Matches:1

R5F213M8UNNP 数据手册

 浏览型号R5F213M8UNNP的Datasheet PDF文件第2页浏览型号R5F213M8UNNP的Datasheet PDF文件第3页浏览型号R5F213M8UNNP的Datasheet PDF文件第4页浏览型号R5F213M8UNNP的Datasheet PDF文件第5页浏览型号R5F213M8UNNP的Datasheet PDF文件第6页浏览型号R5F213M8UNNP的Datasheet PDF文件第7页 
Datasheet  
R8C/3MU Group, R8C/3MK Group  
RENESAS MCU  
R01DS0112EJ0110  
Rev.1.10  
Jun 15, 2011  
1. Overview  
1.1  
Features  
The R8C/3MU Group, R8C/3MK Group of single-chip MCUs incorporates the R8C CPU core, employing  
sophisticated instructions for a high level of efficiency. With 1 Mbyte of address space, and it is capable of  
executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation  
processing.  
Power consumption is low, and the supported operating modes allow additional power control. These MCUs are  
designed to maximize EMI/EMS performance.  
Integration of many peripheral functions, including multifunction timer and serial interface, reduces the number of  
system components.  
The R8C/3MU Group, R8C/3MK Group has data flash (1 KB × 4 blocks) with the background operation (BGO)  
function.  
1.1.1  
Applications  
Peripherals (USB applicable), audio components, cameras, televisions, household appliances, office equipment,  
communication devices, mobile devices, industrial equipment, and other applications.  
R01DS0112EJ0110 Rev.1.10  
Jun 15, 2011  
Page 1 of 88  

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