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R5F21284KSP PDF预览

R5F21284KSP

更新时间: 2024-11-06 03:38:35
品牌 Logo 应用领域
瑞萨 - RENESAS 微控制器
页数 文件大小 规格书
71页 586K
描述
SINGLE-CHIP 16-BIT CMOS MCU

R5F21284KSP 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:SSOP
包装说明:LSSOP, SSOP20,.25针数:20
Reach Compliance Code:compliantHTS代码:8542.31.00.01
风险等级:5.6具有ADC:YES
其他特性:ALSO OPERATES AT 2.2V SUPPLY AT 5 MHZ地址总线宽度:
位大小:16最大时钟频率:20 MHz
DAC 通道:NODMA 通道:NO
外部数据总线宽度:JESD-30 代码:R-PDSO-G20
长度:6.5 mm湿度敏感等级:3
I/O 线路数量:16端子数量:20
最高工作温度:125 °C最低工作温度:-40 °C
PWM 通道:YES封装主体材料:PLASTIC/EPOXY
封装代码:LSSOP封装等效代码:SSOP20,.25
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
峰值回流温度(摄氏度):260电源:2.5/5 V
认证状态:Not QualifiedRAM(字节):1024
ROM(单词):16384ROM可编程性:FLASH
座面最大高度:1.45 mm速度:20 MHz
子类别:Microcontrollers最大压摆率:17 mA
最大供电电压:5.5 V最小供电电压:3 V
标称供电电压:3.3 V表面贴装:YES
技术:CMOS温度等级:AUTOMOTIVE
端子形式:GULL WING端子节距:0.65 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:4.4 mmuPs/uCs/外围集成电路类型:MICROCONTROLLER

R5F21284KSP 数据手册

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R8C/28 Group, R8C/29 Group  
SINGLE-CHIP 16-BIT CMOS MCU  
REJ03B0169-0110  
Rev.1.10  
May 17, 2007  
1. Overview  
These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series  
CPU core, and are packaged in a 20-pin molded-plastic LSSOP. It implements sophisticated instructions for a high  
level of instruction efficiency. With 1 Mbyte of address space, they are capable of executing instructions at high speed.  
Furthermore, the R8C/29 Group has on-chip data flash (1 KB × 2 blocks).  
The difference between the R8C/28 Group and R8C/29 Group is only the presence or absence of data flash. Their  
peripheral functions are the same.  
1.1  
Applications  
Electronic household appliances, office equipment, audio equipment, consumer products, automotive, etc.  
J and K versions are under development. Specifications may be changed without prior notice.  
Rev.1.10 May 17, 2007 Page 1 of 67  
REJ03B0169-0110  

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