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QL4036-1PB256I PDF预览

QL4036-1PB256I

更新时间: 2024-11-10 23:30:39
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其他 - ETC 现场可编程门阵列
页数 文件大小 规格书
12页 199K
描述
Field Programmable Gate Array (FPGA)

QL4036-1PB256I 数据手册

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QL4036 - QuickRAMTM  
36,000 Usable PLD Gate QuickRAM ESP Combining Performance, Density, and Embedded RAM  
QL4036 - QuickRAM  
D
EVICE  
HIGHLIGHTS  
Device Highlights  
High Performance & High Density  
36,000 Usable PLD Gates with 204 I/Os  
672  
High Speed  
Logic Cells  
14 RAM  
Blocks  
}
300 MHz 16-bit Counters, 400 MHz Datapaths,  
160+ MHz FIFOs  
0.35µm four-layer metal non-volatile CMOS process for  
smallest die sizes  
Interface  
FIGURE 1. QuickRAM Block Diagram  
High Speed Embedded SRAM  
14 dual-port RAM modules, organized in user-config-  
urable 1,152 bit blocks  
A
RCHITECTURE  
O
VERVIEW  
5ns access times, each port independently accessible  
Fast and effecient for FIFO, RAM, and ROM functions  
Architecture Overview  
The QuickRAM family of ESPs (Embedded Standard  
Products) offers FPGA logic in combination with Dual-  
Port SRAM modules. The QL4036 is a 36,000  
usable PLD gate member of the QuickRAM family of  
ESPs. QuickRAM ESPs are fabricated on a 0.35mm  
four-layer metal process using QuickLogics patented  
ViaLinkTM technology to provide a unique combina-  
tion of high performance, high density, low cost, and  
extreme ease-of-use.  
Easy to Use / Fast Development Cycles  
100% routable with 100% utilization and complete  
pin-out stability  
Variable-grain logic cells provide high performance and  
100% utilization  
Comprehensive design tools include high quality  
Verilog/VHDL synthesis  
The QL4036 contains 672 logic cells and 14 dual  
port RAM modules (see Figure 1). Each RAM module  
has 1,152 RAM bits, for a total of 16,128 bits. RAM  
Modules are Dual Port (one read port, one write port)  
and can be configured into one of four modes: 64  
(deep) x18 (wide), 128x9, 256x4, or 512x2 (see Fig-  
ure 2). With a maximum of 204 I/Os, the QL4036 is  
available in 144-pin TQFP, 208-pin PQFP and 256-  
pin PBGA packages.  
Advanced I/O Capabilities  
Interfaces with both 3.3V and 5.0V devices  
PCI compliant with 3.3V and 5.0V busses for -1/-2/-3/-4  
speed grades  
Full JTAG boundary scan  
Registered I/O cells with individually controlled clocks and  
output enables  
Designers can cascade multiple RAM modules to  
increase the depth or width allowed in single modules  
by connecting corresponding address lines together  
and dividing the words between modules (see Figure  
3). This approach allows up to 512-deep configura-  
tions as large as 16 bits wide in the smallest Quick-  
RAM device and 44 bits wide in the largest device.  
6-31  
QL4036 Rev F  

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