QL4036 - QuickRAMTM
36,000 Usable PLD Gate QuickRAM ESP Combining Performance, Density, and Embedded RAM
QL4036 - QuickRAM
D
EVICE
HIGHLIGHTS
Device Highlights
High Performance & High Density
■ 36,000 Usable PLD Gates with 204 I/Os
672
High Speed
Logic Cells
14 RAM
Blocks
}
■ 300 MHz 16-bit Counters, 400 MHz Datapaths,
160+ MHz FIFOs
■ 0.35µm four-layer metal non-volatile CMOS process for
smallest die sizes
Interface
FIGURE 1. QuickRAM Block Diagram
High Speed Embedded SRAM
■ 14 dual-port RAM modules, organized in user-config-
urable 1,152 bit blocks
A
RCHITECTURE
O
VERVIEW
■ 5ns access times, each port independently accessible
■ Fast and effecient for FIFO, RAM, and ROM functions
Architecture Overview
The QuickRAM family of ESPs (Embedded Standard
Products) offers FPGA logic in combination with Dual-
Port SRAM modules. The QL4036 is a 36,000
usable PLD gate member of the QuickRAM family of
ESPs. QuickRAM ESPs are fabricated on a 0.35mm
four-layer metal process using QuickLogic’s patented
ViaLinkTM technology to provide a unique combina-
tion of high performance, high density, low cost, and
extreme ease-of-use.
Easy to Use / Fast Development Cycles
■ 100% routable with 100% utilization and complete
pin-out stability
■ Variable-grain logic cells provide high performance and
100% utilization
■ Comprehensive design tools include high quality
Verilog/VHDL synthesis
The QL4036 contains 672 logic cells and 14 dual
port RAM modules (see Figure 1). Each RAM module
has 1,152 RAM bits, for a total of 16,128 bits. RAM
Modules are Dual Port (one read port, one write port)
and can be configured into one of four modes: 64
(deep) x18 (wide), 128x9, 256x4, or 512x2 (see Fig-
ure 2). With a maximum of 204 I/Os, the QL4036 is
available in 144-pin TQFP, 208-pin PQFP and 256-
pin PBGA packages.
Advanced I/O Capabilities
■ Interfaces with both 3.3V and 5.0V devices
■ PCI compliant with 3.3V and 5.0V busses for -1/-2/-3/-4
speed grades
■ Full JTAG boundary scan
■ Registered I/O cells with individually controlled clocks and
output enables
Designers can cascade multiple RAM modules to
increase the depth or width allowed in single modules
by connecting corresponding address lines together
and dividing the words between modules (see Figure
3). This approach allows up to 512-deep configura-
tions as large as 16 bits wide in the smallest Quick-
RAM device and 44 bits wide in the largest device.
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QL4036 Rev F