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PZU5.6B2L,315 PDF预览

PZU5.6B2L,315

更新时间: 2024-11-08 18:47:31
品牌 Logo 应用领域
恩智浦 - NXP /
页数 文件大小 规格书
13页 116K
描述
PZUxBL series - Single Zener diodes DFN 2-Pin

PZU5.6B2L,315 技术参数

Source Url Status Check Date:2013-06-14 00:00:00是否Rohs认证: 符合
生命周期:Transferred零件包装代码:DFN
针数:2Reach Compliance Code:compliant
风险等级:5.78Base Number Matches:1

PZU5.6B2L,315 数据手册

 浏览型号PZU5.6B2L,315的Datasheet PDF文件第2页浏览型号PZU5.6B2L,315的Datasheet PDF文件第3页浏览型号PZU5.6B2L,315的Datasheet PDF文件第4页浏览型号PZU5.6B2L,315的Datasheet PDF文件第5页浏览型号PZU5.6B2L,315的Datasheet PDF文件第6页浏览型号PZU5.6B2L,315的Datasheet PDF文件第7页 
PZUxBL series  
Single Zener diodes  
Rev. 01 — 6 May 2008  
Product data sheet  
1. Product profile  
1.1 General description  
General-purpose Zener diodes in SOD882 leadless ultra small Surface-Mounted  
Device (SMD) plastic package.  
1.2 Features  
I Non-repetitive peak reverse power  
dissipation: PZSM 40 W  
I Low reverse current IR range  
I Total power dissipation: Ptot 250 mW I Small plastic package suitable for  
surface-mounted design  
I Tolerance series:  
I AEC-Q101 qualified  
B: approximately ±5 %;  
B2: approximately ±2 %  
I Wide working voltage range:  
nominal 2.4 V to 36 V (E24 range)  
1.3 Applications  
I General regulation functions  
1.4 Quick reference data  
Table 1.  
Quick reference data  
Symbol Parameter  
Conditions  
IF = 100 mA  
Min  
Typ  
Max  
1.1  
40  
Unit  
V
[1]  
[2]  
VF  
forward voltage  
-
-
-
-
PZSM  
non-repetitive peak reverse  
power dissipation  
W
[3][4]  
Ptot  
total power dissipation  
T
amb 25 °C  
-
-
250  
mW  
[1] Pulse test: tp 300 µs; δ ≤ 0.02.  
[2] tp = 100 µs; square wave; Tj = 25 °C prior to surge  
[3] Reflow soldering is the only recommended soldering method.  
[4] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard  
footprint.  
 
 
 
 
 
 
 
 
 

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