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PZU16BL PDF预览

PZU16BL

更新时间: 2024-11-19 10:19:15
品牌 Logo 应用领域
恩智浦 - NXP 二极管齐纳二极管测试
页数 文件大小 规格书
13页 126K
描述
Single Zener diodes

PZU16BL 技术参数

Source Url Status Check Date:2013-06-14 00:00:00是否无铅: 不含铅
是否Rohs认证: 符合生命周期:Transferred
零件包装代码:DFN包装说明:1 X 0.60 MM, 0.50 MM HEIGHT, LEADLESS, ULTRA SMALL, PLASTIC, SMD, 2 PIN
针数:2Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8541.10.00.50
风险等级:5.7配置:SINGLE
二极管元件材料:SILICON二极管类型:ZENER DIODE
最大动态阻抗:20 ΩJESD-30 代码:R-PBCC-N2
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:2
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:CHIP CARRIER
峰值回流温度(摄氏度):260极性:UNIDIRECTIONAL
最大功率耗散:0.25 W认证状态:Not Qualified
标称参考电压:16 V子类别:Voltage Reference Diodes
表面贴装:YES技术:ZENER
端子面层:Tin (Sn)端子形式:NO LEAD
端子位置:BOTTOM处于峰值回流温度下的最长时间:30
最大电压容差:5%工作测试电流:5 mA
Base Number Matches:1

PZU16BL 数据手册

 浏览型号PZU16BL的Datasheet PDF文件第2页浏览型号PZU16BL的Datasheet PDF文件第3页浏览型号PZU16BL的Datasheet PDF文件第4页浏览型号PZU16BL的Datasheet PDF文件第5页浏览型号PZU16BL的Datasheet PDF文件第6页浏览型号PZU16BL的Datasheet PDF文件第7页 
PZUxBL series  
Single Zener diodes  
Rev. 01 — 6 May 2008  
Product data sheet  
1. Product profile  
1.1 General description  
General-purpose Zener diodes in SOD882 leadless ultra small Surface-Mounted  
Device (SMD) plastic package.  
1.2 Features  
I Non-repetitive peak reverse power  
dissipation: PZSM 40 W  
I Low reverse current IR range  
I Total power dissipation: Ptot 250 mW I Small plastic package suitable for  
surface-mounted design  
I Tolerance series:  
I AEC-Q101 qualified  
B: approximately ±5 %;  
B2: approximately ±2 %  
I Wide working voltage range:  
nominal 2.4 V to 36 V (E24 range)  
1.3 Applications  
I General regulation functions  
1.4 Quick reference data  
Table 1.  
Quick reference data  
Symbol Parameter  
Conditions  
IF = 100 mA  
Min  
Typ  
Max  
1.1  
40  
Unit  
V
[1]  
[2]  
VF  
forward voltage  
-
-
-
-
PZSM  
non-repetitive peak reverse  
power dissipation  
W
[3][4]  
Ptot  
total power dissipation  
T
amb 25 °C  
-
-
250  
mW  
[1] Pulse test: tp 300 µs; δ ≤ 0.02.  
[2] tp = 100 µs; square wave; Tj = 25 °C prior to surge  
[3] Reflow soldering is the only recommended soldering method.  
[4] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard  
footprint.  

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