是否无铅: | 含铅 | 是否Rohs认证: | 不符合 |
生命周期: | Active | 零件包装代码: | DIP |
包装说明: | 0.300 INCH, CERAMIC, DIP-24 | 针数: | 24 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.32.00.61 | 风险等级: | 5.82 |
JESD-30 代码: | R-CDIP-T24 | JESD-609代码: | e0 |
内存密度: | 65536 bit | 内存集成电路类型: | UVPROM |
内存宽度: | 8 | 功能数量: | 1 |
端子数量: | 24 | 字数: | 8192 words |
字数代码: | 8000 | 工作模式: | ASYNCHRONOUS |
最高工作温度: | 125 °C | 最低工作温度: | -55 °C |
组织: | 8KX8 | 封装主体材料: | CERAMIC, METAL-SEALED COFIRED |
封装代码: | WDIP | 封装形状: | RECTANGULAR |
封装形式: | IN-LINE, WINDOW | 并行/串行: | PARALLEL |
峰值回流温度(摄氏度): | NOT SPECIFIED | 认证状态: | Not Qualified |
座面最大高度: | 5.08 mm | 最大供电电压 (Vsup): | 5.5 V |
最小供电电压 (Vsup): | 4.5 V | 标称供电电压 (Vsup): | 5 V |
表面贴装: | NO | 技术: | CMOS |
温度等级: | MILITARY | 端子面层: | TIN LEAD |
端子形式: | THROUGH-HOLE | 端子节距: | 2.54 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 7.62 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
PY26335WMB | PYRAMID |
获取价格 |
UVPROM, 8KX8, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24 | |
PY26345PC | PYRAMID |
获取价格 |
UVPROM, 8KX8, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | |
PY26345PM | PYRAMID |
获取价格 |
UVPROM, 8KX8, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | |
PY26345PMB | PYRAMID |
获取价格 |
UVPROM, 8KX8, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | |
PY26345WC | PYRAMID |
获取价格 |
UVPROM, 8KX8, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24 | |
PY26345WM | PYRAMID |
获取价格 |
UVPROM, 8KX8, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24 | |
PY26345WMB | PYRAMID |
获取价格 |
UVPROM, 8KX8, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24 | |
PY26355PMB | PYRAMID |
获取价格 |
UVPROM, 8KX8, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | |
PY26355WC | PYRAMID |
获取价格 |
UVPROM, 8KX8, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24 | |
PY26355WM | PYRAMID |
获取价格 |
UVPROM, 8KX8, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24 |