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PPC440GX-3RF800CZ PDF预览

PPC440GX-3RF800CZ

更新时间: 2024-11-28 02:51:55
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AMCC PC
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93页 1501K
描述
Power PC 440GX Embedded Processor

PPC440GX-3RF800CZ 数据手册

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Part Number 440GX  
Revision 1.15 – August 30, 2007  
Data Sheet  
440GX  
Power PC 440GX Embedded Processor  
Features  
• PowerPC® 440 processor core operating up to  
800MHz with 32KB I- and D-caches (with parity  
checking)  
• TCP/IP Acceleration Hardware (TAH) provided for  
10/100/1000 Mbps ports that performs checksum  
processing, TCP segmentation, and includes  
support for jumbo frames  
• On-chip 256KB SRAM configurable as L2 Code  
store or Ethernet Packet store memory  
• Programmable Interrupt Controller supports  
interrupts from a variety of sources.  
• Selectable processor:bus clock ratios (Refer to  
the Clocking chapter in the PPC440GX  
• I2O Messaging unit for message transfer between  
the CPU and PCI-X  
Embedded Processor User’s Manual for details)  
• Programmable General Purpose Timers (GPT)  
• Two serial ports (16750 compatible UART)  
• Two IIC interfaces  
• Double Data Rate (DDR) Synchronous DRAM  
(SDRAM) interface operating up to 166MHz  
(200MHz for 800MHz Rev F parts)  
• External Peripheral Bus (32 bits) for up to eight  
devices with external mastering  
• General Purpose I/O (GPIO) interface available  
• JTAG interface for board level testing  
• Processor can boot from PCI memory  
• DMA support for external peripherals, internal  
UART and memory  
• PCI-X V1.0a interface (32 or 64 bits, up to  
133MHz) with support for conventional PCI V2.3  
• Available in ceramic (RoHs and non-RoHS  
compliant versions) and plastic packages (RoHS  
and non-RoHS compliant versions).  
• Two Ethernet 10/100/1000Mbps half- or full-  
duplex interfaces. Operational modes supported  
are SMII, GMII, RGMII, TBI and RTBI.  
Description  
Designed specifically to address high-end embedded  
applications, the PowerPC 440GX (PPC440GX)  
provides a high-performance, low power solution that  
interfaces to a wide range of peripherals by  
incorporating on-chip power management features  
and lower power dissipation.  
Technology: CMOS Cu-11, 0.13μm  
Packages: 25mm, 552-ball Ceramic Ball Grid Array  
(CBGA) or Plastic Ball Grid Array (PBGA) in standard  
or RoHS compliant versions  
Power (estimated): Less than:  
4W typical @533MHz  
This chip contains a high-performance RISC  
processor core, DDR SDRAM controller, configurable  
256KB SRAM to be used as L2 cache or software-  
controlled on-chip memory, PCI-X bus interface,  
Gigabit Ethernet interfaces, TCP/IP acceleration  
hardware, I2O messaging unit, control for external  
ROM and peripherals, DMA with scatter-gather  
support, serial ports, IIC interface, and general  
purpose I/O.  
5W typical @667MHz  
6W typical @800MHz (estimated)  
Supply voltages required: 3.3V, 2.5V, 1.5V  
AMCC  
1

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