是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Not Recommended | 零件包装代码: | QFP |
包装说明: | TFQFP, TQFP80,.55SQ | 针数: | 80 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.31.00.01 | Factory Lead Time: | 5 weeks |
风险等级: | 5.22 | Is Samacsys: | N |
具有ADC: | YES | 地址总线宽度: | 16 |
位大小: | 8 | CPU系列: | PIC18 |
最大时钟频率: | 10 MHz | DAC 通道: | NO |
DMA 通道: | NO | 外部数据总线宽度: | 16 |
格式: | FIXED-POINT | 集成缓存: | NO |
JESD-30 代码: | S-PQFP-G80 | JESD-609代码: | e3 |
长度: | 12 mm | 低功率模式: | NO |
湿度敏感等级: | 3 | DMA 通道数量: | |
外部中断装置数量: | 4 | I/O 线路数量: | 70 |
串行 I/O 数: | 2 | 端子数量: | 80 |
计时器数量: | 5 | 片上数据RAM宽度: | 8 |
片上程序ROM宽度: | 16 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | PWM 通道: | YES |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | TFQFP |
封装等效代码: | TQFP80,.55SQ | 封装形状: | SQUARE |
封装形式: | FLATPACK, THIN PROFILE, FINE PITCH | 峰值回流温度(摄氏度): | 260 |
电源: | 5 V | 认证状态: | Not Qualified |
RAM(字节): | 3840 | RAM(字数): | 3840 |
ROM(单词): | 24576 | ROM可编程性: | FLASH |
座面最大高度: | 1.2 mm | 速度: | 40 MHz |
子类别: | Microcontrollers | 最大压摆率: | 51 mA |
最大供电电压: | 5.5 V | 最小供电电压: | 4.2 V |
标称供电电压: | 5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子面层: | Matte Tin (Sn) | 端子形式: | GULL WING |
端子节距: | 0.5 mm | 端子位置: | QUAD |
处于峰值回流温度下的最长时间: | 40 | 宽度: | 12 mm |
uPs/uCs/外围集成电路类型: | MICROCONTROLLER, RISC | Base Number Matches: | 1 |
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