是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | QFP |
包装说明: | TFQFP, TQFP80,.55SQ | 针数: | 80 |
Reach Compliance Code: | compliant | HTS代码: | 8542.31.00.01 |
风险等级: | 5.21 | 具有ADC: | YES |
地址总线宽度: | 20 | 位大小: | 8 |
CPU系列: | PIC | 最大时钟频率: | 25 MHz |
DAC 通道: | NO | DMA 通道: | NO |
外部数据总线宽度: | 16 | JESD-30 代码: | S-PQFP-G80 |
JESD-609代码: | e3 | 长度: | 12 mm |
湿度敏感等级: | 3 | I/O 线路数量: | 70 |
端子数量: | 80 | 片上程序ROM宽度: | 16 |
最高工作温度: | 125 °C | 最低工作温度: | -40 °C |
PWM 通道: | YES | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TFQFP | 封装等效代码: | TQFP80,.55SQ |
封装形状: | SQUARE | 封装形式: | FLATPACK, THIN PROFILE, FINE PITCH |
峰值回流温度(摄氏度): | 260 | 电源: | 5 V |
认证状态: | Not Qualified | RAM(字节): | 3936 |
ROM(单词): | 24576 | ROM可编程性: | FLASH |
座面最大高度: | 1.2 mm | 速度: | 25 MHz |
子类别: | Microcontrollers | 最大供电电压: | 5.5 V |
最小供电电压: | 4.2 V | 标称供电电压: | 5 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | AUTOMOTIVE | 端子面层: | Matte Tin (Sn) |
端子形式: | GULL WING | 端子节距: | 0.5 mm |
端子位置: | QUAD | 处于峰值回流温度下的最长时间: | 40 |
宽度: | 12 mm | uPs/uCs/外围集成电路类型: | MICROCONTROLLER |
Base Number Matches: | 1 |
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