是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | SSOP |
包装说明: | SSOP, SSOP28,.3 | 针数: | 28 |
Reach Compliance Code: | compliant | ECCN代码: | 3A991.A.2 |
HTS代码: | 8542.31.00.01 | 风险等级: | 0.82 |
Samacsys Confidence: | 3 | Samacsys Status: | Released |
Samacsys PartID: | 159988 | Samacsys Pin Count: | 28 |
Samacsys Part Category: | Integrated Circuit | Samacsys Package Category: | Small Outline Packages |
Samacsys Footprint Name: | PIC18F23K20-I/SS-1 | Samacsys Released Date: | 2015-04-16 09:48:08 |
Is Samacsys: | N | 具有ADC: | YES |
其他特性: | ALSO OPERATES AT 1.8V MINIMUM SUPPLY FOR 20 MHZ | 地址总线宽度: | |
位大小: | 8 | CPU系列: | PIC |
最大时钟频率: | 64 MHz | DAC 通道: | NO |
DMA 通道: | NO | 外部数据总线宽度: | |
JESD-30 代码: | R-PDSO-G28 | JESD-609代码: | e3 |
长度: | 10.2 mm | 湿度敏感等级: | 1 |
I/O 线路数量: | 25 | 端子数量: | 28 |
片上程序ROM宽度: | 16 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | PWM 通道: | YES |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | SSOP |
封装等效代码: | SSOP28,.3 | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE, SHRINK PITCH | 峰值回流温度(摄氏度): | 260 |
电源: | 2/3.3 V | 认证状态: | Not Qualified |
RAM(字节): | 512 | ROM(单词): | 4096 |
ROM可编程性: | FLASH | 座面最大高度: | 2 mm |
速度: | 64 MHz | 子类别: | Microcontrollers |
最大压摆率: | 15 mA | 最大供电电压: | 3.5 V |
最小供电电压: | 3 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子面层: | Matte Tin (Sn) - annealed | 端子形式: | GULL WING |
端子节距: | 0.65 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | 40 | 宽度: | 5.3 mm |
uPs/uCs/外围集成电路类型: | MICROCONTROLLER | Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
PIC18F24K20-I/SS | MICROCHIP |
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PIC18F23K20T-E/SO | MICROCHIP |
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